Solid SiC Focus Ring for Etching

The Solid SiC Focus Ring for Etching from Semixlab combines advanced materials, precision engineering, and proven process performance. Designed for high plasma resistance and minimal contamination, it ensures superior uniformity, longer service life, and stable tool operation in demanding etching environments.

Material Composition and Key Properties

Semixlab’s Solid SiC Focus Ring is made from high-density sintered SiC with exceptional purity and controlled microstructure.

Core Physical properties include:

These properties ensure stable and repeatable performance under demanding etching conditions.

Applications in Semiconductor Etching Processes

1. High-Density Plasma Etching (ICP / RIE)

The SiC focus ring stabilizes plasma density and electric field distribution near the wafer edge, effectively minimizing edge over-etching and improving critical dimension (CD) uniformity. Its robust erosion resistance extends service life even under high ion energy exposure.

2. Deep Reactive Ion Etching (DRIE)

During DRIE processes—common in MEMS and power device manufacturing—the Solid SiC Focus Ring endures repeated ion bombardment and polymer deposition without deformation. Its low particle generation contributes to higher yield and reduced maintenance cycles.

3. Fluorine- and Chlorine-Based Etch Environments

SiC’s chemical inertness prevents reaction with halogen-based plasma gases (SF₆, CF₄, Cl₂, BCl₃), providing long-term dimensional stability and protecting the chamber from contamination or metallic diffusion.

4. High-Power and Long-Duration Etching

With excellent thermal management properties, SiC efficiently dissipates heat from prolonged high-energy etching, maintaining mechanical integrity and dimensional accuracy even under severe temperature cycling.

Semixlab’s Technical Advantages

1. Advanced Material Engineering

Semixlab leverages precision sintering and high-purity SiC powder technology, achieving exceptional material density and microstructural uniformity. Each component undergoes CNC machining and mirror-surface polishing, ensuring precise geometry and reduced plasma interference.

2. Full Customization Capability

We offer custom-designed focus rings tailored to fit various OEM etching platforms (LAM, TEL, AMAT, Oxford, etc.). Geometry, conductivity, and thickness can be optimized according to your plasma environment and wafer size (200 mm / 300 mm / 450 mm).

3. Rigorous Quality Testing

All SiC parts are tested under strict dimensional, thermal, and plasma-resistance standards, including:

● Density and porosity verification

● Plasma erosion simulation and accelerated wear testing

● Surface roughness inspection (Ra ≤ 0.05 μm)

● Thermal stress and flatness certification

Semixlab is a leading manufacturer of high-purity silicon carbide (SiC) components in China, specializing in precision-engineered Solid SiC Focus Rings for advanced plasma etching systems. Engineered for exceptional plasma resistance, thermal stability, and dimensional precision, each focus ring ensures uniform plasma distribution and superior etch profile control.

For custom designs, technical consultation, or sample evaluation, please contact our semiconductor materials specialists.