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PZT piezoelectric thin-film wafers
Semixlab’s PZT Piezoelectric thin-film Wafers serve as the core functional material for high-end MEMS devices. Leveraging advanced PVD (Physical Vapor Deposition) processes, we have achieved polycrystalline PZT thin-film deposition on 6-inch and 8-inch standard substrates, characterized by exceptionally high piezoelectric constants and superior uniformity. With atomic-scale flatness and precise crystal orientation control, our products significantly enhance electromechanical conversion efficiency while ensuring production-grade consistency and high yields. They are perfectly suited for cutting-edge MEMS applications—including acoustic transducers, precision micropumps, and RF communications—empowering our customers to bridge the gap from laboratory R&D to large-scale mass production seamlessly.
Description
Typical Stack
Designed for mainstream MEMS fabrication, we provide standard, highly validated stack structures that ensure seamless integration with semiconductor processing lines.
| Layer | Core Function | Technical Features |
| Top Electrode | Signal Transmission | High conductivity and excellent process stability using noble metal. |
| Piezoelectric Layer | Energy Conversion | High-density, strongly (100) oriented PZT thin film with high driving force. |
| Buffer Layer | Crystalline Orientation | Optimized interface energy; suppresses element diffusion; enhances ferroelectric fatigue resistance. |
| Bottom Electrode | High-Reliability Base | Premium noble metal electrode ensuring long-term electrical stability. |
| Adhesion Layer | Bonding & Connection | Enhances the mechanical adhesion between the electrode and the substrate. |
| Substrate (Si/SOI) | Structural Support | Fully compatible with 8-inch standard Silicon (Si) or SOI platforms. |
Customization & Foundry Services
Tailored Solutions for High-Performance Piezoelectric Applications
Our Services
● Custom Thin Films: Specific film types & precision thickness tuning.
● OEM Foundry: High-quality growth on customer-supplied wafers.
● SOI Integration: Specialized deposition for advanced RF/MEMS.
Specifications
| Parameter | Specification |
| Wafer Size | 6-inch / 8-inch |
| Top Si Resistivity | > 5,000 Ω`cm |
| Dopant & Thickness | Customizable per design |
| BOX Layer | Support for varied thicknesses |
Applications
Our 8-inch PZT piezoelectric wafers are engineered to meet high-precision demands across various industries, serving as the cornerstone for efficient electromechanical conversion:
● Acoustics & Communication Innovation: Ideal for Piezoelectric Micromachined Ultrasonic Transducers (pMUT) and Acoustic MEMS (e.g., high-performance speakers and microphones). With superior sensitivity and phase consistency, our wafers enable clearer audio and high-precision ultrasonic imaging. Additionally, high Q-factor characteristics perfectly suit RF MEMS filters for 5G/6G signal processing.
● Precision Fluidics & Nano-Actuation: For Inkjet Printheads and precision fluid control, our high piezoelectric coefficients ensure high-frequency stability and drop-volume consistency. In Medical/Aesthetic Micropumps and Atomization, excellent fatigue resistance guarantees precise flow control during long-term operation.
● Industrial & Medical Reliability: From micro-scale motion capture to high-energy ultrasonic nebulization, our PZT solutions provide stable power output, helping clients overcome the size and efficiency bottlenecks of traditional electromagnetic drives.
Competitive Advantage
Excellent Electromechanical Conversion Efficiency
Based on advanced texture orientation control technology, the thin film features an ultra-high effective piezoelectric coefficient e31,f. As the core power source for MEMS actuators, it enables high-frequency, large-displacement deformation output at extremely low driving voltages.
Mass-Production Grade Process Uniformity
Atomic-level film formation control technology ensures the thickness uniformity of 8-inch full-wafer thin films reaches industry benchmark levels. Sub-nanometer surface roughness perfectly meets the processing requirements of precision acoustic and optical microstructures.
Stringent Quality and Reliability
Ultra-low defect density and superior particle control significantly improve the patterning yield in subsequent micro-nano fabrication. Optimized multi-layer stack structure and dedicated buffer layer design effectively suppress ferroelectric fatigue, ensuring long-term stability of devices under complex operating conditions.
