Shield 150mm Sputter Etch

The Shield 150MM Sputter Etch 0200-09083 is a precision semiconductor chamber component designed for 150 mm wafer sputter etch systems. Installed inside plasma processing chambers, this shield plays a critical role in protecting internal chamber structures from direct plasma exposure, sputtered particles, and process by-products. Manufactured from high-purity semiconductor-grade materials. Its optimized geometry helps control deposition accumulation, maintain chamber cleanliness, and support stable plasma conditions for consistent wafer processing. As a key chamber protection component, the Shield 0200-09083 helps extend equipment service life, reduce contamination risks, and improve overall process stability. We look forward to receiving your inquiry.

Product Overview

The SHIELD 150MM SPUTTER ETCH 0200-09083 is a chamber protection component installed within plasma processing systems used for sputter etching and surface preparation processes. It is designed specifically for 150 mm wafer processing platforms and forms part of the chamber’s internal protection structure.

Key Product Information

Within sputter etch modules, the shield functions as a protective barrier that isolates sensitive chamber hardware from plasma exposure and deposition build-up.

As part of the internal chamber architecture, the shield contributes to maintaining a stable processing environment and reliable equipment operation.

Function Inside Semiconductor Equipment

Inside sputter etch systems, the Shield 0200-09083 performs several important functions that directly affect chamber performance and wafer processing quality.

Chamber Protection

The shield acts as a sacrificial protective layer that prevents sputtered particles and reactive plasma from directly impacting the chamber walls and critical hardware.

By absorbing deposition and plasma exposure, it helps extend the service life of expensive chamber components.

Particle and Deposition Control

During sputter etching processes, particles and material deposition may accumulate inside the chamber. The shield captures much of this material, helping to:

● Reduce particle generation

● Improve chamber cleanliness

● Maintain stable process conditions

Plasma Boundary Stabilization

The physical geometry of the shield helps define the plasma region within the chamber. This contributes to stable ion distribution and consistent process performance.

Protection of Key Components

The shield helps protect sensitive chamber elements such as:

● Electrostatic chucks

● Heater assemblies

● Chamber liners

● Gas distribution structures

By limiting direct plasma exposure, the shield supports reliable long-term equipment operation.

Material and Advantages

The 0200-09083 Sputter Etch Shield is typically manufactured from high-purity fused quartz, a material widely used in semiconductor equipment due to its excellent performance in plasma environments.

Advantages of High-Purity Quartz

Outstanding Plasma Resistance: Quartz exhibits strong resistance to ion bombardment and plasma erosion, allowing it to withstand prolonged exposure to sputtering processes.

Ultra-Low Contamination Risk: Semiconductor-grade quartz contains extremely low metallic impurities, helping reduce particle contamination during wafer processing.

Excellent Thermal Stability: Fused quartz maintains its structural integrity under elevated temperatures and rapid thermal cycling commonly encountered in plasma chambers.

Electrical Insulation: Quartz is an electrically insulating material, which helps maintain stable electric fields and improves plasma uniformity inside the process chamber.

Chemical Compatibility: Quartz demonstrates strong resistance to reactive gases used in sputter etch processes, ensuring long-term stability and minimal degradation.

These material properties make quartz an ideal choice for plasma-exposed semiconductor chamber components.