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Semiconductor-Grade Quartz Wafer Boat & Carrier
The Semixlab High-Purity Quartz Wafer Boat – also referred to as a quartz wafer carrier or cassette – is a thermal‑field component used extensively in high‑temperature semiconductor processing. It is made from ultra‑high‑purity fused silica (SiO₂ ≥ 99.999%) and serves as a structural carrier for silicon, SiC, and GaN wafers in thermal diffusion, oxidation, annealing, LPCVD, and PECVD steps.
Description
Product Overview
Produced under rigorous quality control, Semixlab quartz boats maintain total metallic impurity levels below 15 ppm (validated by GDMS or ICP‑OES) and offer a low‑hydroxyl option at < 5 ppm. These products show strong resistance to sagging, deformation, and metal contamination during demanding high‑temperature furnace operations.
Available Customization
Semixlab supports customised quartz wafer boats – including ladder boats, horizontal plate boats, shell boats, and batch carriers – built to customer drawings, CAD files, and equipment specifications.
Specifications
Key Specifications & Technical Performance
| Property | Semixlab Value | Benefit |
| Chemical Purity | SiO₂ ≥ 99.999%; Fe, Cu, Li, Na, K < 15 ppm | Minimizes metallic contamination |
| Hydroxyl Content | Low-OH grade < 5 ppm; Standard < 30 ppm | Improves high-temperature stability |
| Working Temperature | 1200°C continuous / 1300°C peak | Maintains rigidity during furnace cycles |
| Thermal Expansion | 0.45 × 10⁻⁶ /°C | Excellent thermal shock resistance |
| Slot Pitch Accuracy | ±0.05 mm | Reliable robotic wafer handling |
| Surface Finish | Flame annealed / Micro-polished (Rz < 0.8 μm) | Reduces particles and micro-cracks |
Applications
Process Applications
· Thermal oxidation and annealing furnaces
· Boron / phosphorus dopant diffusion processes
· LPCVD and PECVD thin-film deposition
· Third-generation semiconductor manufacturing (SiC & GaN)
Competitive Advantage
Core Value Proposition & Technical Advantages
1. Sub‑Micron Machining & Precision Slotting
Advanced CNC laser machining and diamond slotting give us tight control over slot geometry, which supports automated wafer loading and helps prevent wafer damage.
2. Ultra‑Low Hydroxyl High‑Viscosity Fused Quartz
Our special low‑OH fused quartz delivers good structural stability and minimises shape change during long thermal cycles above 1100°C.
3. Fire‑Polished Surface Protection
Flame annealing and chemical polishing increase surface density, improve cleaning durability, and reduce particle generation.
4. OEM Equipment Compatibility
We offer custom replacement quartz boats for TEL, ASM, Kokusai, SVCS, LPE, and other thermal processing systems.
Our Services
