Quartz Shadow Ring 200mm

The Quartz Shadow Ring 200mm (Part No. 0200-10445) is a precision-machined semiconductor component designed for 200 mm wafer processing equipment. It plays a critical role in wafer edge protection, plasma distribution control, and chamber contamination reduction during plasma etching and deposition processes.

Manufactured from high-purity fused quartz, this shadow ring offers excellent resistance to plasma corrosion, thermal stability, and ultra-low contamination levels, making it ideal for demanding semiconductor manufacturing environments.

At Semixlab, we supply high-precision quartz components engineered to meet the strict dimensional tolerance and purity standards required for semiconductor process equipment.

Product Overview

The 0200-10445 Quartz Shadow Ring is installed around the wafer edge inside the process chamber. It is designed to provide controlled shadowing of the wafer perimeter, helping maintain consistent process conditions across the wafer surface.

This component is widely used in etch chambers and plasma processing systems, where accurate edge control is essential for achieving high wafer yield and process uniformity.

Typical Structural Features

The 0200-10445 Quartz Shadow Ring is engineered with structural characteristics specifically optimized for semiconductor chamber integration.

Wafer-Matched Inner Diameter: The inner diameter is precisely designed to match the 200 mm wafer edge, ensuring accurate positioning and consistent shadowing effects.

Precision-Machined Geometry: The component is manufactured with tight tolerances to guarantee proper alignment with surrounding chamber parts and maintain stable process conditions.

Alignment Notches: Many designs incorporate alignment notches or positioning features to ensure correct installation orientation within the equipment.

Optimized Thickness: The ring thickness is carefully controlled to provide the right balance between mechanical strength and plasma shielding performance.

Smooth Surface Finish: A high-quality polished surface reduces particle generation and improves compatibility with cleanroom environments.

Role in Semiconductor Equipment

The Quartz Shadow Ring plays a critical role in maintaining stable processing conditions inside plasma chambers.

1. Wafer Edge Process Control

During plasma etching or deposition, the wafer edge region can experience non-uniform plasma exposure. The shadow ring provides controlled shielding of the wafer perimeter, preventing excessive etching or deposition at the edge.

This helps improve:

● wafer edge uniformity

● process repeatability

● device yield

2. Protection of Chamber Components

The shadow ring also protects key chamber components such as:

● electrostatic chuck (ESC)

● pedestal or heater

● surrounding chamber surfaces

By blocking direct plasma exposure and deposition, it reduces wear and extends the lifetime of these critical parts.

3. Plasma Distribution Stabilization

The ring geometry helps regulate the plasma sheath near the wafer edge, contributing to more uniform plasma density and improved process control across the wafer.

4. Particle Reduction

By controlling deposition regions and shielding sensitive surfaces, the shadow ring helps reduce particle formation inside the chamber, which is essential for high-yield semiconductor manufacturing.

Material and Key Advantages

The shadow ring is manufactured using high-purity fused quartz (SiO₂), a material widely used in semiconductor fabrication due to its outstanding chemical and thermal properties.

High Plasma Resistance:

Quartz demonstrates excellent resistance to fluorine-based and chlorine-based plasma environments, which are commonly used in semiconductor etching processes. This ensures long service life and stable performance.

Ultra-Low Contamination:

High-purity quartz contains extremely low levels of metallic impurities, helping minimize contamination risks in the process chamber and maintaining wafer quality.

Superior Thermal Stability:

Quartz materials offer excellent thermal shock resistance and high-temperature stability, allowing the shadow ring to perform reliably under repeated heating and cooling cycles in plasma chambers.

Excellent Chemical Inertness:

Quartz remains chemically stable in harsh semiconductor processing environments, reducing degradation and particle generation.

Precision Machinability:

With advanced machining and polishing processes, quartz can achieve tight dimensional tolerances and smooth surface finishes, which are essential for stable wafer processing conditions.