Quartz Bell Jar

Quartz Bell Jar is a core protective component in the semiconductor manufacturing process. It is made of ultra-high purity synthetic quartz material and is designed for harsh semiconductor, photovoltaic and high-end vacuum equipment environments. In key processes such as CVD (chemical vapor deposition), diffusion furnace, etching, ion implantation, etc., the quartz bell jar provides a pollution-free and highly uniform process environment for the wafer through its excellent high temperature resistance, extremely low thermal expansion coefficient and excellent chemical stability.

Application:

Quartz Bell Jar is a bell-shaped protective cover made of high-purity quartz glass, which has excellent high temperature resistance, chemical stability and optical transparency. It is widely used in laboratories, semiconductor processes, vacuum systems, precision instrument protection and other fields.

Services that can be provided:

customer application scenario analysis, matching materials, technical problem solving.

Company profile:

Semixlab has 2 laboratories, a team of experts with 20 years of material experience, with R&D and production, testing and verification capabilities.

Main application fields

Ecological chain verification endorsement

Semixlab quartz bell jar's ecological chain verification covers raw materials to production, has passed international standard certification, and has a number of patented technologies to ensure its reliability and sustainability in the semiconductor and new energy fields.

Typical application process

Raw Material Preparation (High purity quartz sand) → Melt Forming → Temperature controlled annealing → Precision Machining(Cutting, grinding, chamfering) → Quality Inspection → Surface treatment (optional) → Packaging

With the rapid development of semiconductor, photovoltaic and new energy industries, the market demand for high-purity quartz bell jars will continue to expand. Semixlab quartz bell jar is gradually replacing imports in mid-to-high-end application fields by improving material purity, optimizing coating processes and breaking through large-size manufacturing technology.

For detailed technical specifications, white papers, or sample testing arrangements, please contact our Technical Support Team to explore how Semixlab can enhance your process efficiency.

Semixlab Quartz Bell Jar core advantages

Ultra-high purity quartz material - ensure zero process pollution

Semixlab Quartz Bell Jar is made of 99.99% high-purity synthetic quartz, and the metal impurity content is strictly controlled below 1ppm, which fundamentally eliminates the risk of metal contamination during wafer processing. The extremely low hydroxyl content (OH<10ppm) ensures that water vapor will not be released during high-temperature processes to avoid affecting sensitive processes. Through precise bubble control technology, the product bubble rate is less than 0.1%, and the optical uniformity reaches the industry's top level, providing a perfect working environment for laser processes and optical inspections.

Excellent temperature resistance - adapt to extreme process environments

The quartz bell jar has excellent high temperature stability and can withstand the harsh working environment of 1200°C for a long time, and can withstand the ultra-high temperature process requirements of 1450°C in the short term. Thanks to the ultra-low thermal expansion coefficient, it can still maintain dimensional stability under drastic temperature changes, avoiding the risk of cracking due to thermal stress. The excellent thermal shock resistance enables it to adapt to the frequent temperature rise and fall process in semiconductor manufacturing, significantly improving the equipment utilization rate.

Chemical inertness & corrosion resistance - extended service life

Our quartz bell jars exhibit excellent chemical stability and are able to resist corrosion from highly corrosive media such as HF and HCl, making them perfect for various etching and cleaning processes in semiconductor manufacturing. Special surface treatment processes give them excellent resistance to plasma erosion, a dense surface without pores, and effectively reduce particle deposition. Through precision polishing processes, the surface roughness can be controlled at Ra≤0.4μm (optionally super-polished to Ra≤0.1μm), minimizing the impact on the wafer surface.

Excellent optical performance - supports precision optical processes

The product maintains a high transmittance of more than 90% in the ultraviolet to infrared bands, which is particularly suitable for process links with strict requirements on optical performance. The unique material formula and manufacturing process effectively reduce the fluorescence effect and avoid interference with precision optical detection. This excellent optical property makes it an ideal choice for advanced processes such as laser annealing and UV curing.

Customized design - precise matching of equipment requirements

We provide a full range of customized services, and various product sizes can perfectly adapt to various equipment requirements. Special designs can be made according to customer drawings.