Liner Quartz Upper Gas Dist
The AMAT Liner Qtz Upper Gas Dist is a precision-engineered quartz component used in semiconductor plasma processing equipment. Designed as part of the upper chamber assembly, this component integrates both chamber protection (liner) and gas distribution functionality, making it essential for maintaining stable and uniform processing conditions. The 0200-09445 quartz liner is engineered for high purity, precision, and durability, ensuring reliable performance in demanding plasma environments.
Description
Product Overview
The AMAT 0200-09445 Liner Qtz Upper Gas Dist is installed in the upper region of semiconductor process chambers, typically in systems used for etching or chemical vapor deposition (CVD) processes.
Key Product Information
| Item | Description |
| Product Name | Liner Qtz Upper Gas Distribution |
| Part Number | 0200-09445 |
| Material | High-Purity Fused Quartz |
| Component Type | Chamber Liner / Gas Distribution Component |
| Application | Etch / CVD / Plasma Processing |
| Installation Position | Upper Chamber Region |
| Supplier | Semixlab |
This component is part of a broader gas distribution and chamber liner system, working in conjunction with lower liners and gas distribution plates to ensure consistent process conditions.
The 0200-09445 is not a simple quartz ring or liner—it is a hybrid functional component that combines two critical roles within the process chamber:
Quartz Liner (Chamber Protection Layer)
As a liner, it acts as a protective barrier between the plasma environment and the chamber’s metal surfaces. It absorbs deposition, prevents contamination, and extends the service life of the chamber.
Upper Gas Distribution Component
At the same time, it is designed to support and guide process gas flow in the upper chamber region. Working together with gas plates or showerheads, it helps distribute gases evenly across the wafer.
Material and Key Characteristics
The AMAT 0200-09445 Liner is manufactured from semiconductor-grade fused quartz (SiO₂), a material widely used for plasma-exposed components due to its exceptional performance.
Key Material Characteristics
Ultra-High Purity: The quartz used contains extremely low levels of metallic impurities, reducing contamination risks and supporting advanced semiconductor manufacturing standards.
Excellent Plasma Resistance: Fused quartz withstands ion bombardment and reactive plasma environments, making it suitable for long-term use in etch and CVD processes.
Superior Thermal Stability: The material maintains structural integrity under high temperatures and thermal cycling, ensuring consistent performance over time.
Chemical Inertness: Quartz resists corrosion from reactive gases such as fluorine- and chlorine-based chemistries commonly used in semiconductor processes.
Electrical Insulation: As a non-conductive material, quartz helps maintain stable electric fields and contributes to uniform plasma distribution.
These properties make quartz an ideal material for components combining gas flow control and plasma exposure.
Applications
Function Inside Semiconductor Equipment
The 0200-09445 Quartz Upper Gas Distribution Liner plays several critical roles inside semiconductor process chambers, directly influencing process quality and equipment reliability.
Gas Distribution Optimization
The component helps guide and distribute process gases across the chamber, ensuring:
● Uniform gas flow
● Consistent reactant distribution
● Stable processing conditions
This is essential for achieving uniform etch rates or film deposition across the wafer surface.
Chamber Protection
As a sacrificial liner, it protects chamber walls and structural components from:
● Plasma exposure
● Chemical reactions
● Deposition buildup
This reduces maintenance costs and extends the lifespan of expensive chamber hardware.
Plasma Stability Enhancement
By providing a stable dielectric surface in the upper chamber, the quartz liner helps:
● Maintain consistent plasma boundaries
● Reduce electrical disturbances
● Improve process repeatability
Contamination and Particle Control
The liner captures process by-products and minimizes particle generation, helping to:
● Maintain chamber cleanliness
● Reduce defect rates
● Improve wafer yield
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