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AMAT 0200-09445 Liner Qtz Upper Gas Dist
AMAT 0200-09445 Liner Qtz Upper Gas Dist

Liner Quartz Upper Gas Dist


The AMAT Liner Qtz Upper Gas Dist is a precision-engineered quartz component used in semiconductor plasma processing equipment. Designed as part of the upper chamber assembly, this component integrates both chamber protection (liner) and gas distribution functionality, making it essential for maintaining stable and uniform processing conditions. The 0200-09445 quartz liner is engineered for high purity, precision, and durability, ensuring reliable performance in demanding plasma environments.

Description

Product Overview

The AMAT 0200-09445 Liner Qtz Upper Gas Dist is installed in the upper region of semiconductor process chambers, typically in systems used for etching or chemical vapor deposition (CVD) processes.

Key Product Information

ItemDescription
Product NameLiner Qtz Upper Gas Distribution
Part Number0200-09445
MaterialHigh-Purity Fused Quartz
Component TypeChamber Liner / Gas Distribution Component
ApplicationEtch / CVD / Plasma Processing
Installation PositionUpper Chamber Region
SupplierSemixlab

This component is part of a broader gas distribution and chamber liner system, working in conjunction with lower liners and gas distribution plates to ensure consistent process conditions.

The 0200-09445 is not a simple quartz ring or liner—it is a hybrid functional component that combines two critical roles within the process chamber:

Quartz Liner (Chamber Protection Layer)

As a liner, it acts as a protective barrier between the plasma environment and the chamber’s metal surfaces. It absorbs deposition, prevents contamination, and extends the service life of the chamber.

Upper Gas Distribution Component

At the same time, it is designed to support and guide process gas flow in the upper chamber region. Working together with gas plates or showerheads, it helps distribute gases evenly across the wafer.

Material and Key Characteristics

The AMAT 0200-09445 Liner is manufactured from semiconductor-grade fused quartz (SiO₂), a material widely used for plasma-exposed components due to its exceptional performance.

Key Material Characteristics

Ultra-High Purity: The quartz used contains extremely low levels of metallic impurities, reducing contamination risks and supporting advanced semiconductor manufacturing standards.

Excellent Plasma Resistance: Fused quartz withstands ion bombardment and reactive plasma environments, making it suitable for long-term use in etch and CVD processes.

Superior Thermal Stability: The material maintains structural integrity under high temperatures and thermal cycling, ensuring consistent performance over time.

Chemical Inertness: Quartz resists corrosion from reactive gases such as fluorine- and chlorine-based chemistries commonly used in semiconductor processes.

Electrical Insulation: As a non-conductive material, quartz helps maintain stable electric fields and contributes to uniform plasma distribution.

These properties make quartz an ideal material for components combining gas flow control and plasma exposure.

Applications

Function Inside Semiconductor Equipment

The 0200-09445 Quartz Upper Gas Distribution Liner plays several critical roles inside semiconductor process chambers, directly influencing process quality and equipment reliability.

Gas Distribution Optimization

The component helps guide and distribute process gases across the chamber, ensuring:

● Uniform gas flow

● Consistent reactant distribution

● Stable processing conditions

This is essential for achieving uniform etch rates or film deposition across the wafer surface.

Chamber Protection

As a sacrificial liner, it protects chamber walls and structural components from:

● Plasma exposure

● Chemical reactions

● Deposition buildup

This reduces maintenance costs and extends the lifespan of expensive chamber hardware.

Plasma Stability Enhancement

By providing a stable dielectric surface in the upper chamber, the quartz liner helps:

● Maintain consistent plasma boundaries

● Reduce electrical disturbances

● Improve process repeatability

Contamination and Particle Control

The liner captures process by-products and minimizes particle generation, helping to:

● Maintain chamber cleanliness

● Reduce defect rates

● Improve wafer yield

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