0200-10073 Insulator Quartz 200mm

The AMAT 0200-10073 Insulator Quartz 200mm is a precision-engineered fused quartz component designed to provide electrical insulation and structural stability within semiconductor plasma processing equipment. It is commonly used as a cathode insulator in 200mm etch and deposition systems.

Manufactured from ultra-high purity quartz, this component is specifically developed to operate in demanding environments involving:

● High-frequency RF power

● High-energy plasma exposure

● Reactive process chemistries (e.g., fluorine, chlorine gases)

● Rapid thermal cycling conditions

Unlike standard protective quartz parts, this insulator plays a critical electrical role, ensuring stable RF coupling and preventing unintended current paths inside the chamber.

At Semixlab Technology, the AMAT 0200-10073 equivalent is produced under strict quality control to meet or exceed OEM specifications, ensuring reliable, repeatable performance in advanced semiconductor manufacturing.

Position in Equipment and Functional Role

Installation Position

The Quartz Insulator is typically installed:

● Around or within the lower cathode assembly

● Near the electrostatic chuck (ESC)

● In the RF-powered electrode region of the chamber

It is located in the core plasma generation and RF interaction zone, where electrical isolation is essential.

Core Functions

1. Electrical Isolation (Primary Function)

The component acts as a high-performance dielectric barrier, providing:

● Isolation between conductive electrodes and chamber structures

● Prevention of RF leakage and unintended current paths

2. RF Field Stabilization

By maintaining defined electrical boundaries, the insulator helps:

● Stabilize RF coupling efficiency

● Maintain consistent plasma density distribution

3. Plasma Stability Enhancement

The quartz insulator contributes to:

● Controlled plasma confinement

● Reduced electrical noise and instability

Benefit: More uniform ion energy distribution and consistent process outcomes.

4. Mechanical Support and Thermal Stability

With its cylindrical or pipe-like structure, the component also provides:

● Structural support for cathode assemblies

● Excellent thermal resistance under cyclic heating conditions

Common Failure Modes

As a critical electrical and plasma-facing component, the Quartz Insulator is subject to several degradation mechanisms:

1. Electrical Degradation

● Surface contamination creates conductive paths

● Reduced dielectric performance over time

Impact: RF instability, leakage currents, or process drift.

2. Plasma-Induced Erosion

● Ion bombardment leads to surface roughening

● Gradual material loss alters geometry

Impact: Changes in electric field distribution and plasma behavior.

3. Arc Damage (Electrical Discharge)

● Localized high electric field causes arcing

● Surface burning or pitting

Impact: Severe contamination and potential chamber damage.

4. Thermal Stress Cracking

● Repeated heating and cooling cycles

● Micro-cracks propagate over time

Impact: Mechanical failure and unexpected downtime.

5. Particle Generation

● Aging quartz releases micro-particles

● Surface degradation increases contamination risk

Impact: Yield loss and increased defectivity.

Why Choose Semixlab Technology?

With deep expertise in semiconductor materials and process components, Semixlab Technology delivers high-performance quartz solutions tailored for demanding plasma environments:

✔ Ultra-High Purity Quartz: Minimizes contamination and ensures stable dielectric performance.

✔ Precision Machining: Tight tolerances for consistent electrical spacing and OEM compatibility.

✔ Optimized Surface Treatment: Reduces particle generation and enhances plasma compatibility.

✔ Extended Service Life: Improves durability under RF and plasma exposure, lowering cost of ownership (CoO).

✔ OEM-Compatible Design: Seamless integration with AMAT platforms without process disruption.

The AMAT 0200-10073 Insulator Quartz is widely used in:

● Applied Materials 200mm Etch Systems

● Plasma etching processes (poly, dielectric, conductor etch)

● CVD and PVD chambers requiring RF insulation

It is especially critical in legacy and specialty semiconductor manufacturing, including:

● Power devices (IGBT, SiC)

● MEMS fabrication

● Analog and mixed-signal production