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Applied materials AMAT quartz ring
Semixlab AMAT Quartz Rings boast ultra-high purity, minimizing contamination and maximizing process integrity. Experience superior etching, deposition, and diffusion uniformity, leading to unparalleled process control and consistency.This translates to fewer defects, higher yields, and ultimately, a more cost-effective production cycle for your fab.
Description
Semixlab provides high precision quartz ring. This product is mainly used to ensure the stable deposition of high-quality films in the PECVD process, while maximizing the production efficiency of the equipment and the yield of wafers. The plasma distribution is constrained by geometric accuracy (±0.1mm), the reaction gas flow field is optimized, and the uniformity of the film is improved to σ≤1.5%. The adsorption process by-products have reduced the wafer defect rate by 30%.
Quick Detail:
Nicknames: Quartz ring, Si wafer carrier,Quartz Ring Kit、Quartz Ring Kit，Upper Chamber Ring，PECVD Deposition Ring，Gas Distribution Ring
Purpose: Ensure the stable deposition of high-quality films in the PECVD process, while maximizing the production efficiency of the equipment and the yield of wafers.
Core parameters: It is particularly recommended for SiN (silicon nitride) deposition processes, high-purity quartz, and special coating services can be provided. It can withstand high temperatures of 300 to 400℃+, resist plasma erosion, with quartz purity ≥99.99%, metal impurity content less than 5ppm, bubble/inclusion diameter ≤0.1mm, and the number ≤3 per cubic centimeter
Main functions and roles:
●Key components of the chamber: Located inside the PECVD process chamber, they form an important boundary of the reaction area.
●High-temperature and plasma resistance: Made of high-purity Quartz, it features excellent high-temperature resistance (the PECVD process temperature is typically within the range of 300°C to 400°C+) and resistance to plasma erosion.
●Electrical isolation/insulation: It plays a crucial role in electrical insulation within the chamber, ensuring the stable generation of plasma and process uniformity.
●Process gas sealing:Assist in maintaining the sealing of the process gas environment within the chamber.
●The definition of the wafer process environment: Its geometry and surface condition directly affect the distribution of gas flow and plasma above the wafer, which is crucial for the uniformity and quality of thin film deposition.
●Surface coating: Some quartz rings used in specific processes (such as SiN) may be coated with special coatings (such as yttrium oxide Yttria) to further reduce by-product deposition or enhance performance and service life under specific processes.
Applied materials AMAT quartz ring Application scenarios
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