Quartz Shadow Ring 200mm

The AMAT 0200-10445 Quartz Shield Ring (200 mm) is a high-purity quartz edge control component designed specifically for plasma etching systems. It falls under the category of shield rings, which are critical for controlling plasma interaction at the wafer edges during semiconductor processing.

Manufactured from ultra-high-purity fused quartz, this component is engineered to operate under extreme process conditions, including:

● High-energy plasma environments

● Reactive fluorine- and chlorine-based chemicals

● Repeated thermal cycling

Unlike standard protective components, the shadow ring is a process-critical part that directly influences etch profile, uniformity, and critical dimension (CD) control.

At Semixlab Technology, our quartz shadow rings are manufactured using the following processes:

● Strict raw material selection to ensure low contamination

● High-precision machining to ensure geometric consistency

● Optimized surface treatment to minimize particle generation

This ensures stable and repeatable performance in advanced etching processes.

Common Failure Modes

As a consumable component exposed to harsh plasma environments, quartz shadow rings are subject to the following degradation mechanisms:

1. Plasma-Induced Erosion

● Continuous ion bombardment leads to surface roughening

● Gradual material loss alters critical geometries

Impact:

Deterioration of edge control performance, resulting in critical dimension (CD) deviations and profile instability.

2. Polymer and Byproduct Deposition

● Process byproducts accumulate on the quartz surface

● Deposits may flake off during operation

Impact:

Increased particle contamination and defect density on wafers.

3. Thermal Stress Cracking

● Repeated heating and cooling cycles generate internal stresses

● Microcracks may propagate, leading to structural failure

Impact:

Unexpected breakage and equipment downtime.

4. Particle Generation Due to Material Aging

● Long-term plasma exposure compromises the integrity of the quartz

● Microcracks release particles into the chamber

Impact:

Decreased yield and reduced device reliability.

Why Choose Semixlab?

With deep expertise in semiconductor materials and process components, Semixlab Technology offers high-performance replacement parts that meet or exceed OEM standards:

● Ultra-high-purity quartz for contamination-sensitive processes

● Precision-engineered geometries for exact edge control

● Extended service life and reduced cost of ownership (CoO)

● OEM-compatible designs that integrate seamlessly with AMAT platforms

Our quartz shadow rings are trusted by semiconductor fabs, supporting manufacturers seeking reliable, cost-effective, and high-performance alternatives for plasma etching applications.

Equipment Location and Functions

Installation Location

Quartz shadow rings are typically installed:

● Around the wafer edge region

● Above or near the electrostatic chuck (ESC)

● Within the plasma sheath region of the etch chamber

It works in conjunction with other edge components (such as focusing rings and cover rings) to form a complete edge control system.

Core Functions

1. Plasma Shielding and Ion Distribution Control

The primary function of the shield ring is to create a “shielding effect”:

● Selectively blocking or modulating plasma exposure at the wafer edge

● Adjusting ion incidence angles and ion distribution

Results:

Improved etch profile control, including sidewall angles and feature fidelity.

2. Edge Uniformity Optimization

Through its precisely engineered geometry (height, gap, and profile), the shadow ring can:

● Reduce edge over-etching and micro-load effects

● Improve etch rate uniformity across the wafer

Impact:

Improves critical dimension (CD) consistency and enhances wafer edge yield.

3. Process Stability and Repeatability

This component stabilizes plasma behavior in the edge region by:

● Maintaining consistent plasma sheath conditions

● Reduce process drift during extended production runs

Benefits:

Improves process window stability and repeatability in high-volume production.

4. Contamination and Byproduct Control

The shadow ring also helps to:

● Limit unwanted deposition areas

● Control the distribution of polymers and byproducts

This reduces particle risk and contributes to cleaner chamber operation.