Quartz Ring 150mm

As a plasma-exposed component, the quartz ring is designed to operate in high-energy environments while maintaining structural stability and process consistency.

Key Product Information

Material and Advantages

The AMAT Quartz Ring 150mm is manufactured from semiconductor-grade fused quartz (SiO₂), a material widely recognized for its excellent performance in plasma processing environments.

Key Advantages of Fused Quartz:

Ultra-Low Contamination

High-purity quartz contains extremely low levels of metallic impurities, minimizing the risk of wafer contamination and supporting advanced semiconductor manufacturing standards.

Excellent Plasma Resistance

Quartz offers strong resistance to ion bombardment and plasma erosion, making it suitable for long-term use in sputter etch and plasma chambers.

High Thermal Stability

The material maintains its structural integrity under high temperatures and rapid thermal cycling, ensuring consistent performance during processing.

Electrical Insulation

As a non-conductive material, quartz helps stabilize the electric field within the chamber, contributing to uniform plasma distribution.

Chemical Inertness

Quartz is resistant to reactive gases used in semiconductor processes, reducing degradation and extending component lifetime.

These properties make fused quartz an ideal material for chamber components exposed to plasma and high-temperature conditions.

Function Inside Semiconductor Equipment

The AMAT Quartz Ring 150mm performs several critical functions inside plasma processing chambers, directly impacting process stability and wafer quality.

1. Plasma Confinement and Control

The quartz ring helps define the plasma boundary region, controlling ion distribution and stabilizing plasma behavior within the chamber. This contributes to repeatable and consistent process conditions.

2. Edge Uniformity Optimization

Positioned near the wafer edge, the ring plays an important role in:

● Regulating plasma density at the wafer perimeter

● Reducing edge effects

● Improving etch or deposition uniformity

This is essential for maintaining critical dimension (CD) control and overall wafer yield.

3. Chamber Protection

As a sacrificial component, the quartz ring absorbs:

● Sputtered materials

● Etch by-products

● Plasma exposure

This helps protect critical chamber components such as metal walls, liners, and electrostatic chucks from damage and contamination.

4. Process Stability Enhancement

By maintaining consistent geometry and material properties, the quartz ring supports:

● Stable gas flow patterns

● Controlled plasma interaction

● Reduced particle generation

This ultimately leads to improved process repeatability and reduced downtime.