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AMAT 0200-15699 Quartz Insulator Grounding Ring
AMAT 0200-15699 Quartz Insulator Grounding Ring

0200-15699 Quartz Insulator Grounding Ring


The AMAT 0200-15699 Quartz Insulator Grounding Ring is a high-purity quartz component engineered for electrical isolation and controlled grounding in 200mm plasma etch chambers. Manufactured by Semixlab Technology with ultra-high purity quartz and precision machining and Installed near the electrostatic chuck (ESC) and RF electrode structures, this ring minimizes particle generation and contamination, delivering long-term reliability for semiconductor fabs. It is an ideal solution for OEM-compatible replacement parts in advanced plasma processing systems. Looking forward to your further inquiry.

Description

The AMAT 0200-15699 Quartz Insulator Grounding Ring is a high-purity fused quartz component designed to provide electrical isolation and controlled grounding within semiconductor plasma processing equipment. It combines the functions of a dielectric insulator and a grounding interface, making it a critical part of the chamber’s electrical architecture.

Engineered for use in etch, CVD, and PVD systems, this component operates in environments characterized by:

● High-frequency RF power

● High-energy plasma exposure

● Reactive process chemistries

● Repeated thermal cycling

Unlike standard quartz protection parts, this grounding ring plays a process-critical electrical role, directly influencing plasma stability, RF field distribution, and process repeatability.

At Semixlab Technology, the Quartz Insulator Grounding Ring is manufactured with:

● Ultra-high purity quartz to minimize contamination and conductivity risks

● Precision machining to ensure consistent electrical spacing and OEM compatibility

● Controlled surface finishing to reduce particle generation and electrical instability

This ensures reliable performance in advanced semiconductor manufacturing environments.

Position in Equipment and Functional Role

Installation Position

The Quartz Insulator Grounding Ring is typically installed:

Around the electrostatic chuck (ESC) perimeter

Near RF electrode structures

At the interface between plasma-exposed regions and grounded components

It is located within the plasma sheath boundary and RF field interaction zone, where precise electrical control is essential.

Core Functions

1. Electrical Isolation (Dielectric Barrier)

The quartz material acts as a high-performance dielectric, providing:

● Isolation between conductive components

● Prevention of unintended current paths

● Protection against electrical short circuits

2. Controlled Grounding Path

As part of the grounding structure, the ring:

● Establishes a stable reference potential

● Regulates current return paths within the chamber

3. Plasma Stability and RF Field Control

By defining electrical boundaries, the component helps:

● Stabilize plasma density distribution

● Maintain consistent ion էնergy and trajectory near the wafer

4. Arc Suppression and Electrical Reliability

Proper insulation and grounding reduce localized electric field concentration, helping to:

● Minimize arcing (arc discharge)

● Prevent chamber damage and process interruptions

Common Failure Modes

As a critical component exposed to both electrical stress and plasma environments, the Quartz Insulator Grounding Ring is subject to several degradation mechanisms:

1. Electrical Degradation and Surface Conductivity

● Contamination (metallic or process residues) may create conductive paths

● Dielectric performance may degrade over time

Impact: Unstable RF behavior, increased risk of leakage currents or arcing.

2. Plasma-Induced Erosion

● Ion bombardment leads to surface roughening

● Material loss alters electrical spacing and field distribution

Impact: Reduced control over plasma behavior and increased process variability.

3. Metal Contamination and Deposition

● Deposition of conductive materials on quartz surfaces

● Alteration of insulating properties

Impact: Potential grounding failure and electrical instability.

4. Thermal Stress Cracking

● Repeated heating and cooling cycles induce internal stress

● Micro-cracks may develop and propagate

Impact: Mechanical failure and unexpected downtime.

5. Particle Generation from Material Aging

● Long-term exposure weakens quartz structure

● Micro-fractures release particles into the chamber

Impact: Yield loss and increased defectivity in semiconductor devices.

Why Choose Semixlab Technology?

With deep expertise in semiconductor materials and process components, Semixlab Technology delivers high-performance quartz solutions tailored for advanced plasma environments:

● Ultra-high purity materials for superior electrical insulation and contamination control

● Precision-engineered designs for stable RF and plasma interaction

● Extended service life to reduce cost of ownership (CoO)

● OEM-compatible manufacturing for seamless integration with AMAT systems

Our Quartz Insulator Grounding Rings are trusted by semiconductor fabs seeking reliable, high-quality alternatives for critical electrical components.

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