PSPI photosensitive polyimide photoresist

Semixlab PSPI photosensitive polyimide packaging material

PSPI is a liquid photosensitive resin material for semiconductor manufacturers. It serves mutiple crucial functions in semiconductor production,acting as a surface protection film for semiconductor elements, a passivation layer for bumps, and an insulating layer for rewiring.

This material stands out due to its outstanding characteristics. It offers excellentheat - and chemical -resistance capabilities. Moreover, it boasts remarkableelectrical and mechanical properties.

To meet the evolving needs of the industry, we have developed a diverse productportfolio. These products are well - equipped to fulfill the requirements of next -generation packaging technology, ensuring that we can provide solutions thatkeep pace with the latest advancements in the semiconductor field.

Application：

It is mainly used in the semiconductor field, for the surface protective film of semiconductor components, raised passivation layer, rewiring insulation layer and so on. It is also increasingly used in cutting-edge packages that require multi-layer formation.

Services that can be provided:

customer application scenario analysis, matching materials, technical problem solving.

Company profile：

Semixlab has 2 laboratories, a team of experts with 20 years of material experience, with R&D and production, testing and verification capabilities.

Quick Detail:

1. Different names for products：PSPI photosensitive polyimide photoresist/PSPI/Photosensitive insulating /PSPI photosensitive polyimide packaging material/Photosensitive Polyimide.

2. Main Application：It is mainly used in the semiconductor field, for the surface protective film of semiconductor components, raised passivation layer, rewiring insulation layer and so on. It is also increasingly used in cutting-edge packages that require multi-layer formation.Mainly in the field of medium and high Semiconductor packaging.

3. Core Specifications：

Photosensitive resolution ≤3um, thermal stability up to 320℃, dielectric constant 3.3 (1MHz), adhesion 40Mpa, strong acid and alkali corrosion resistance, narrow process window, mainly in the field of medium and high packaging.

Product performance comparison table：

Typical application process

Through the innovation of material molecular structure and optimization of process parameters, Semixlab PSPI has achieved breakthrough progress in domestic high-end packaging materials, providing reliable packaging guarantee for cutting-edge fields such as 5G RF modules, automotive-grade power modules, and AI chips. If you need to obtain detailed technical white papers or arrange sample testing, please contact our technical support team.

Semixlab PSPI Core Advantages

1. Ultra-high-precision lithography

3μm resolution to meet the needs of micro-bump and RDL routing for 2.5D/3D packages.

Steep and straight sidewall morphology (85°-88°) to enhance the reliability of multilayer stacking.

2. Extreme environmental stability

Glass transition temperature above 330°C to adapt to the high temperature packaging of power devices.

Low dielectric loss (Df<0.005) for high-frequency millimeter-wave scenarios Low dielectric loss (Df<0.005), suitable for high-frequency millimeter-wave scenarios.

3. Breakthrough in process compatibility

Supports i-line/g-line dual-band exposure, compatible with mainstream domestic lithography equipment.

Developing latitude ±15%, reducing the impact of process fluctuations.

4. Domestication of technological innovations

Independently developed "nano-crosslinking enhancement" technology, increasing mechanical strength by 30%.

Halogen-free environmentally friendly formulations in line with EHS international standards.

Main Application Areas:

5. Eco-chain validation endorsement

Has passed the reliability certification of the head packaging and testing factories, such as Changdian Technology and Tomfool Microelectronics, and is suitable for SMIC's 55nm BCD process.