ArF Photoresist Material for Photolithography

Semixlab Photoresist Material

Photoresist refers to an etching-resistant thin film material whose solubility changes under the irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, etc. Photoresist occupies a special position in the integrated circuit chip manufacturing process. The higher the integration of the integrated circuit, the higher the requirements for photoresist. Semiconductor photoresists are divided into g-line, i-line photoresists, KrF, ArF photoresists and EUV photoresists, among which the process node of ArF photoresist is 7nm - 130nm.

Our R&D center has the ability to develop functional monomers, functional resins, photosensitizers and other photoresist materials, and can achieve full independence from photoresist raw materials to photoresist products and supporting materials. Currently, the verification of high-end photoresists such as ArF dry process, KrF thick film glue, and I-line is progressing steadily, three ArF photoresists have been verified, which ensures that we can provide solutions that keep pace with the latest developments in the semiconductor field.

Application:

ArF photoresist materials are crucial key materials in the field of integrated circuit manufacturing and can be used in integrated circuit manufacturing processes at 90nm~14nm and even 7nm technology nodes. They are widely used in integrated circuit manufacturing, 3D-IC advanced packaging, IC traditional packaging and testing, and other fields. They are widely used in high-end chip manufacturing, including logic chips, AI chips, 5G chips, large-capacity memory chips, and cloud computing chips.

Services that can be provided:

customer application scenario analysis, matching materials, technical problem solving.

Company profile:

Semixlab has 2 laboratories, a team of experts with 20 years of material experience, with R&D and production, testing and verification capabilities.

Quick Detail:

1. main application：It is widely applied in fields such as integrated circuit manufacturing, 3D-IC advanced packaging, and traditional IC packaging and testing. And high-end chip manufacturing, including logic chips, AI chips, 5G chips, large-capacity memory and cloud computing chips, etc.

2. Core specification parameters：

Substrate Si(HMDS), film thickness 1.25μm, pre-bake 100℃ 60sec, exposure 120℃ 90sec, resolution 7nm~90nm, shelf life half a year, stored at low temperature, not more than 20℃.

Product performance

Main application fields

Ecological chain verification endorsement

193nm ArF photoresist has been verified by two chip manufacturers, storage and logic, becoming the first ArF photoresist product to pass verification in China.

Typical application process

Raw material preparation → Wafer cleaning → Cleaning the photoresist layer(solvent cleaning or plasma cleaning) → Pretreatment (acid cleaning and surface activation) → Control of the thickness of the photoresist layer → Coating and film formation → Exposure and development → Etching protection → Subsequent processing (stripping, cleaning and annealing)

Through process parameter optimization, Semixlab photoresist has achieved breakthrough progress in the field of domestic high-end photoresist, gradually replaced imports in the semiconductor photoresist market, and has been successfully applied to the production and manufacturing of LCD, OLED and other display panels. If you need to obtain detailed technical white papers or arrange sample testing, please contact our technical support team.

Semixlab Photoresist Core advantages

Product performance advantages

High resolution: makes the circuit pattern on the chip more refined, improving the integration and performance of the chip.

High contrast and high transmittance: helps to better achieve pattern transfer during the lithography process, improve the accuracy and efficiency of lithography, and thus improve the yield and reliability of the chip.

Technological research and development advantages

Achieve full independence from photoresist raw materials to photoresist products and supporting materials.

ArF photoresist has been certified for downstream customers' memory chip 50nm and logic chip 55nm technology node products.

Capacity expansion and mass production

We will reach an annual production scale of 25 tons of 193nm (ArF dry and immersion) photoresist products, which will be used to develop the industrialization of photoresist and supporting materials to meet the needs of the integrated circuit industry.