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CMP polishing abrasive
CMP polishing slurry
CMP polishing abrasive
CMP polishing slurry

CMP polishing abrasive


Place of Origin:China
Brand Name:Semixlab
Model Number:SXL-1
Certification:ISO14001, ISO45001, ISO9001
Minimum Order Quantity:Subject to negotiation
Price:Contact for Customized Quotation
Packaging Details:Standard export package
Delivery Time:15-30 Days After Order Confirmation
Payment Terms:T/T
Supply Ability:10 tons/Month
Description

CMP (Chemical Mechanical Planarization) polishing abrasive is a key material in the fields of semiconductor manufacturing, optical glass, integrated circuits, etc., and achieve nano-level surface flattening through the synergistic effect of chemical corrosion and mechanical grinding.

Application:

CMP polishing abrasives are crucial key materials in the field of integrated circuit manufacturing and can be used in integrated circuit ILD, semiconductor monocrystalline silicon wafers, semiconductor silicon carbide, integrated circuit shallow trench isolation (STI), integrated circuit polysilicon (Poly - Si), integrated circuit metals and metal barrier layers.

Services that can be provided:

customer application scenario analysis, matching materials, technical problem solving.

Company profile:

Semixlab has 2 laboratories, a team of experts with 20 years of material experience, with R&D and production, testing and verification capabilities.

Specifications

Performance Indicators for Ultra-High Purity Series Products

ParameterSXL-1SXL-2SXL-3SXL-4SXL-5SXL-6SXL-7
Average SilicaParticle Size/nm35±545±565±575±585±5100±5120±5
Nanoparticle SizeDistribution (PDI)<0.15<0.15<0.15<0.15<0.15<0.15<0.15
Solution pH7.2-7.47.2-7.47.2-7.47.2-7.47.2-7.47.2-7.47.2-7.4
Solid Content/%20.5±0.520.5±0.520.5±0.520.5±0.520.5±0.520.5±0.520.5±0.5
AppearanceLight BlueBlueWhiteOff-WhiteOff-WhiteOff-WhiteOff-White
Particle Morphology XX:S- pherical;B- Curved;P- Peanut-shaped;T- Bulbous;C- Chain-like (aggregated state)
Stabilizing IonsOrganic/Inorganic Amines
Raw material Composition YY:M-TMOS;E-TEOS;ME-TMOS+TEOS;EM-TEOS+TMOS
Metal Impurity Content≤300ppb
Applications

Main application fields

Application directionTypical scenario
Semiconductor ManufacturingIntegrated Circuit (IC) Chips and Third Generation Semiconductor Materials
Optics and Display TechnologyOptical glass, lens and display panel
Storage DevicesHard disk platters and 3D NAND flash memory
Advanced PackagingWafer-level packaging (WLP), TSV (through silicon via)
Other high-end applicationsMEMS (Micro-Electro-Mechanical Systems) and Medical Implants

Ecological chain verification endorsement

Semixlab CMP polishing abrasives meet the semiconductor industry certification and have passed the ISO 14001/45001/9001 certification

Typical application process

Raw material → Abrasive Synthesis (Surface modification)→ Slurry Formulation (Filtration/PH adjustment)→ CMP polishing (EPD control)→ Post-Clean → Inspection (AFM/KLA)→ Data Feedback Optimization

Through process parameter optimization, Semixlab CMP polishing abrasive has achieved breakthrough progress in the field of domestic high-end semiconductor integrated circuit, gradually replaced imports in the semiconductor market, and has been successfully applied to the production and manufacturing of LCD, OLED and other display panels. If you need to obtain detailed technical white papers or arrange sample testing, please contact our technical support team.

Competitive Advantage

Semixlab CMP polishing abrasive core advantages

a.Freely adjustable particle diameter and degree of particle aggregation;

b.Monodisperse particles with uniform particle size distribution;

c.Stable dispersion system;

d.Large-scale production capability with minimal batch-to-batch variation;

e.Highly stable, resistant to agglomeration and sedimentation.

Our Services

Semixlab Product Shop

Semixlab CMP polishing abrasive shops

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