High-Purity Isostatic Graphite Sealing Rings
Semixlab’s High-Purity Isostatic Graphite Sealing Rings are designed to support stable and contamination-controlled operation of advanced semiconductor manufacturing equipment. Manufactured from ultra-high-purity isostatically pressed graphite, these sealing rings provide reliable sealing performance in high-temperature, high-vacuum, and chemically aggressive environments commonly encountered in epitaxy, CVD / LPCVD / PECVD, diffusion, oxidation, RTP, and etch processes. Semixlab’s graphite sealing rings help maintain process stability, reduce particle and metal contamination risks, and extend equipment maintenance cycles. We welcome your inquiries.
Description
High-Purity Isostatic Graphite Sealing Rings from Semixlab are manufactured from ultra-high-purity isostatically pressed graphite, these sealing rings provide stable, low-contamination sealing performance that directly supports process reliability, yield consistency, and equipment uptime across advanced front-end wafer fabrication processes.
In epitaxy systems, where precise control of gas flow, pressure stability, and thermal uniformity is essential, Semixlab’s High-Purity Isostatic Graphite Sealing Rings play a critical role in maintaining reactor integrity at sustained temperatures often exceeding 1000 °C. Installed at chamber interfaces, sealing boundaries, and rotating or stationary joints within the hot zone, these sealing rings exhibit low and isotropic thermal expansion, allowing them to maintain dimensional stability during repeated thermal cycling. Their exceptionally low metallic impurity content minimizes the risk of unintentional dopant incorporation or metal contamination, helping ensure uniform epitaxial layer thickness, controlled doping profiles, and high-quality crystalline growth in both silicon and compound semiconductor epitaxy processes.
In CVD, LPCVD, and PECVD applications, sealing components are exposed to a combination of high temperature, vacuum, corrosive precursor gases, and in some cases plasma environments. Semixlab’s High-Purity Isostatic Graphite Sealing Rings are widely used in chamber door seals, gas isolation structures, and transition zones between hot and cold regions of the reactor. The intrinsic chemical resistance of high-purity graphite enables stable operation in the presence of aggressive process gases such as HCl, NH₃, and halogen-based precursors, while the dense, isotropic microstructure reduces particle generation and mechanical degradation over extended service life. Compared to metallic sealing solutions, graphite sealing rings offer superior resistance to corrosion and thermal fatigue, contributing to longer maintenance intervals and improved process repeatability in high-volume manufacturing.
High-temperature diffusion, oxidation, and rapid thermal processing place stringent demands on sealing performance due to extreme temperatures, rapid thermal ramp rates, and frequent process cycling. In these environments, Semixlab’s High-Purity Isostatic Graphite Sealing Rings maintain consistent sealing integrity at temperatures exceeding 1100 °C, supporting stable atmospheric control within furnace tubes and RTP chambers. The uniform mechanical properties provided by isostatic pressing help prevent localized stress concentration, micro-cracking, and seal distortion during rapid heating and cooling, thereby contributing to stable dopant diffusion profiles, uniform oxide growth, and repeatable thermal process outcomes critical for advanced logic and memory device fabrication.
In Etch process, including dry etching applications that utilize halogen-based chemistries and plasma-assisted environments, sealing rings are required to maintain vacuum integrity while limiting particle generation and chemical degradation. Semixlab’s High-Purity Isostatic Graphite Sealing Rings are typically deployed in non-direct plasma exposure zones, such as chamber periphery sealing interfaces and structural isolation regions. When combined with appropriate surface densification or protective coatings, these sealing rings provide reliable resistance to corrosive etch gases and thermal stress, supporting stable chamber conditions and reducing the risk of contamination-related yield loss.
Engineered with a focus on material purity, structural stability, and long-term reliability, Semixlab’s High-Purity Isostatic Graphite Sealing Ring's compatibility with advanced coating technologies and integration into complex semiconductor equipment architectures make them a trusted solution for leading-edge and mature process nodes alike. By delivering consistent sealing performance under the most demanding process conditions, Semixlab supports semiconductor manufacturers in achieving higher yield, improved equipment utilization, and lower total cost of ownership. We sincerely look forward to becoming your long-term partner in China.
Specifications
| Physical properties of isostatic graphite | ||
| Property | Unit | Typical Value |
| Bulk Density | g/cm³ | 1.83 |
| Hardness | HSD | 58 |
| Electrical Resistivity | μΩ.m | 10 |
| Flexural Strength | MPa | 47 |
| Compressive Strength | MPa | 103 |
| Tensile Strength | MPa | 31 |
| Young' s Modulus | GPa | 11.8 |
| Thermal Expansion(CTE) | 10-6K-1 | 4.6 |
| Thermal Conductivity | W·m-1·K-1 | 130 |
| Average Grain Size | μm | 8-10 |
| Porosity | % | 10 |
| Ash Content | ppm | ≤5 (after purified) |
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