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CVD Silicon Carbide (SiC) Coating

CVD Silicon Carbide (SiC) Coating

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SiC coated wafer susceptor
SiC coated wafer susceptor

SiC coated wafer susceptor


Quick Detail:

Purpose: Specifically designed for semiconductor CVD (1000°C - 1400°C) and PVD high-temperature processes, it provides a stable support platform for wafers.

Core parameters: Surface roughness Ra < 0.5 μm;high hardness (>2500 HV);the coefficient of thermal expansion (CTE) is precisely matched (≈ 2.6 x 10⁻⁶/K), completely eliminating wafer warpage or slip caused by thermal stress.

Description

Semixlab provides high performance wafer susceptor. This product is mainly applied to semiconductor CVD PVD equipment to provide support for wafers and prevent any damage and accidental drops caused by nitrogen flow.

SiC Coated silicon carbide base (SiC coated Susceptor) is widely used in semiconductors due to its features such as high-temperature resistance, corrosion resistance, high purity and less pollution to wafers.

Application:

Specifically designed for semiconductor CVD (1000°C - 1400°C) and PVD high-temperature processes, it provides a stable support platform for wafers.

Core features:

Outstanding high-temperature stability: Withstands extreme temperatures above 1400°C, ensuring precise wafer positioning without any deviation.

Super strong protection: Effectively resist the impact of nitrogen flow >10 m/s and accidental drops, providing maximum protection for the wafer.

Outstanding durability: The SiC coating offers high hardness (>2500 HV) and corrosion resistance, extending service life.

High-purity surface: Surface roughness Ra < 0.5 μm, reducing the risk of particle contamination.

Silicon base (silicon Susceptor)

Application: Suitable for high-temperature processes of silicon wafers with extremely high requirements for thermal matching (such as epitaxial growth, <1200°C).

Core features:

● Perfect thermal matching: Consistent with the wafer material (monocrystalline silicon), the coefficient of thermal expansion (CTE) is precisely matched (≈ 2.6 x 10⁻⁶/K), completely eliminating wafer warpage or slip caused by thermal stress.

● Fast delivery: The delivery cycle of standard products is significantly shortened, as low as 4-6 weeks (compared with 8-12 weeks for SiC bases).

● High purity: Meets the standards of semiconductor-grade silicon materials.

● Surface quality: Precisely polished, surface roughness Ra < 0.2 μm.

Specifications
Basic physical properties of CVD SiC coating
PropertyTypical Value
Crystal StructureFCC β phase polycrystalline, mainly (111) oriented
Density3.21 g/cm³
Hardness2500 Vickers hardness(500g load)
Grain Size2~10μm
Chemical Purity99.99995%
Heat Capacity640 J·kg-1·K-1
Sublimation Temperature2700℃
Flexural Strength415 MPa RT 4-point
Young's Modulus430 Gpa 4pt bend, 1300℃
Thermal Conductivity300W·m-1·K-1
Thermal Expansion(CTE)4.5×10-6K-1
Applications

SiC epitaxial layer growth graphite susceptor.

Gas inlet diversion and thermal field control in SiC epitaxial growth furnace.

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