SiC coated wafer susceptor
Quick Detail:
Purpose: Specifically designed for semiconductor CVD (1000°C - 1400°C) and PVD high-temperature processes, it provides a stable support platform for wafers.
Core parameters: Surface roughness Ra < 0.5 μm;high hardness (>2500 HV);the coefficient of thermal expansion (CTE) is precisely matched (≈ 2.6 x 10⁻⁶/K), completely eliminating wafer warpage or slip caused by thermal stress.
Description
Semixlab provides high performance wafer susceptor. This product is mainly applied to semiconductor CVD PVD equipment to provide support for wafers and prevent any damage and accidental drops caused by nitrogen flow.
SiC Coated silicon carbide base (SiC coated Susceptor) is widely used in semiconductors due to its features such as high-temperature resistance, corrosion resistance, high purity and less pollution to wafers.
Application:
Specifically designed for semiconductor CVD (1000°C - 1400°C) and PVD high-temperature processes, it provides a stable support platform for wafers.

Core features:
Outstanding high-temperature stability: Withstands extreme temperatures above 1400°C, ensuring precise wafer positioning without any deviation.
Super strong protection: Effectively resist the impact of nitrogen flow >10 m/s and accidental drops, providing maximum protection for the wafer.
Outstanding durability: The SiC coating offers high hardness (>2500 HV) and corrosion resistance, extending service life.
High-purity surface: Surface roughness Ra < 0.5 μm, reducing the risk of particle contamination.

Silicon base (silicon Susceptor)
Application: Suitable for high-temperature processes of silicon wafers with extremely high requirements for thermal matching (such as epitaxial growth, <1200°C).
Core features:
● Perfect thermal matching: Consistent with the wafer material (monocrystalline silicon), the coefficient of thermal expansion (CTE) is precisely matched (≈ 2.6 x 10⁻⁶/K), completely eliminating wafer warpage or slip caused by thermal stress.
● Fast delivery: The delivery cycle of standard products is significantly shortened, as low as 4-6 weeks (compared with 8-12 weeks for SiC bases).
● High purity: Meets the standards of semiconductor-grade silicon materials.
● Surface quality: Precisely polished, surface roughness Ra < 0.2 μm.

Specifications
| Basic physical properties of CVD SiC coating | |
| Property | Typical Value |
| Crystal Structure | FCC β phase polycrystalline, mainly (111) oriented |
| Density | 3.21 g/cm³ |
| Hardness | 2500 Vickers hardness(500g load) |
| Grain Size | 2~10μm |
| Chemical Purity | 99.99995% |
| Heat Capacity | 640 J·kg-1·K-1 |
| Sublimation Temperature | 2700℃ |
| Flexural Strength | 415 MPa RT 4-point |
| Young's Modulus | 430 Gpa 4pt bend, 1300℃ |
| Thermal Conductivity | 300W·m-1·K-1 |
| Thermal Expansion(CTE) | 4.5×10-6K-1 |
Applications
SiC epitaxial layer growth graphite susceptor.
Gas inlet diversion and thermal field control in SiC epitaxial growth furnace.
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