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CVD Silicon Carbide (SiC) Coating

CVD Silicon Carbide (SiC) Coating

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SiC Coated ICP Etching Susceptor
SiC Coated ICP Etching Susceptor

SiC Coated ICP Etching Susceptor


The SiC Coated ICP Etching Susceptor is a high-performance wafer support component designed for ICP plasma etching applications in advanced semiconductor manufacturing. Built on a high-purity semiconductor-grade isostatic graphite substrate and protected by a dense SiC coating, it delivers exceptional plasma resistance, thermal stability, and contamination control in high-density, high-power etching environments. By ensuring uniform heat transfer, stable wafer positioning, and long-term durability against aggressive halogen-based chemistries, this susceptor supports improved process consistency, extended component lifetime, and reduced cost of ownership for modern ICP etching systems. We look forward to receiving your inquiry.

Description

The SiC Coated ICP Etching Susceptor is a critical plasma contact component specifically engineered for advanced ICP (Inductively Coupled Plasma) etching processes in semiconductor manufacturing. Within the high-density plasma environment where process stability, thermal uniformity, and contamination control directly dictate yield and device performance, the graphite susceptor serves as the fundamental interface between the wafer, plasma, and thermal management system.

Semixlab Susceptors utilize high-purity semiconductor-grade isostatic graphite material coated with a dense Silicon Carbide layer. This structure combines graphite's superior thermal conductivity and machinability with SiC's exceptional plasma corrosion resistance and chemical inertness. The resulting robust solution withstands high RF power, corrosive halide-based chemicals, and intense ion bombardment common in ICP etching processes.

Within the ICP etch chamber, the graphite susceptor plays a central role in wafer positioning, temperature control, and process repeatability. It provides precise mechanical support for wafers while enabling efficient heat transfer to support rear helium cooling and stable temperature regulation. Uniform thermal behavior across the wafer surface is critical for maintaining consistent etch rates, critical dimension (CD) uniformity, and profile control—especially in high aspect ratio and anisotropic etching applications. The SiC coating minimizes localized temperature fluctuations and reduces plasma-induced degradation.

From a plasma interaction perspective, the SiC coating serves as a highly durable barrier against fluorine- and chlorine-based plasmas commonly used for etching silicon, dielectrics, and wide bandgap materials. Compared to uncoated graphite or traditional ceramic materials, its low corrosion rate and high resistance to micro-arcing significantly extend component lifespan. Simultaneously, the dense SiC layer suppresses particle generation and metal contamination, meeting stringent cleanliness requirements in advanced semiconductor fabs while supporting higher overall equipment uptime and mean time between failures (MTBF).

The SiC Coated ICP Etching Susceptor embodies Semixlab Technology's profound understanding of plasma etching physics, materials engineering, and semiconductor manufacturing requirements. By integrating high-purity Graphite Susceptors with advanced SiC Coating technology, the Silicon Carbide Coated ICP Etching Susceptor delivers a balanced solution that effectively enhances process stability, extends component lifespan, and supports the continuous advancement of ICP etching technology.

As a leading Chinese manufacturer of SiC-coated ICP etching susceptors, Semixlab is committed to providing advanced technical consulting and customized product solutions for the semiconductor etching industry. We sincerely look forward to becoming your long-term partner in China.

Specifications
Basic physical properties of CVD SiC coating
PropertyTypical Value
Crystal StructureFCC β phase polycrystalline, mainly (111) oriented
Density3.21 g/cm³
Hardness2500 Vickers hardness(500g load)
Grain Size2~10μm
Chemical Purity99.99995%
Heat Capacity640 J·kg-1·K-1
Sublimation Temperature2700℃
Flexural Strength415 MPa RT 4-point
Young' s Modulus430 Gpa 4pt bend, 1300℃
Thermal Conductivity300W·m-1·K-1
Thermal Expansion(CTE)4.5×10-6K-1
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