SiC coated halfmoon graphite parts
SiC coated halfmoon graphite parts are precision-engineered components for silicon and silicon carbide epitaxy systems. Featuring a high-purity graphite substrate with a dense SiC coating, these parts provide excellent resistance to high-temperature hydrogen and corrosive precursor gases while maintaining stable surface behavior. The halfmoon geometry is optimized to improve gas flow control and edge uniformity, supporting consistent epitaxial layer quality and long-term process reliability. Welcome for your inquiry.
Description
SiC coated halfmoon graphite parts are critical components widely used in advanced silicon epitaxy and silicon carbide (SiC) epitaxy systems. Within epitaxial reactors, these components serve as structural, gas flow shaping, and protective elements, directly impacting film uniformity, edge characteristics, and long-term process stability. Their precise thermal control, chemical stability, and ultra-low contamination are essential for device performance and manufacturing yield, making them indispensable key graphite components in semiconductor epitaxial processes.
In both silicon and silicon carbide epitaxy processes, crescent-shaped graphite components are typically positioned near the substrate or wafer edge regions, where gas flow dynamics and temperature gradients are most sensitive. The crescent geometry is specifically engineered to optimize local gas distribution and thermal equilibrium, thereby mitigating edge effects that could lead to epitaxial layer thickness variations, doping concentration fluctuations, or crystal defects.

From a material composition perspective, the graphite substrate offers excellent thermal conductivity and machinability, enabling precise fabrication of complex crescent shapes to match specific reactor designs. To ensure compatibility with corrosive epitaxial environments, the graphite surface is coated with a dense layer of high-purity silicon carbide (SiC). This SiC coating acts as a chemically inert barrier, exhibiting outstanding corrosion resistance against hydrogen, HCl, and silicon-based precursor gases commonly used in epitaxial processes. Consequently, the component maintains structural integrity and surface stability during prolonged high-temperature operation (typically exceeding 1500°C in SiC epitaxy).
From a contamination control perspective, SiC coated halfmoon graphite parts play a critical role in maintaining a clean process environment. The SiC coating effectively suppresses graphite particle generation and prevents the release or absorption of metallic impurities, helping fabs meet stringent particle and purity requirements. This is particularly vital in SiC epitaxy, where even trace contamination degrades epitaxial crystal quality.
Compared to uncoated graphite or alternative materials, SiC-coated half-moon graphite parts achieve an optimal balance between durability, thermal performance, and cost-effectiveness. Their extended service life reduces maintenance frequency and chamber downtime, while stable surface characteristics contribute to consistent batch-to-batch performance. These advantages make them indispensable consumable components in high-volume Si/SiC epitaxial production lines.
As a leading Chinese manufacturer and supplier of semiconductor epitaxial process components, Semixlab consistently provides advanced technical consulting and customized product solutions to industry clients. We empower semiconductor manufacturers to achieve higher yields, enhanced process repeatability, and extended equipment reliability throughout epitaxial growth. We sincerely look forward to becoming your long-term partner in China.
Specifications
| Basic physical properties of CVD SiC coating | |
| Property | Typical Value |
| Crystal Structure | FCC β phase polycrystalline, mainly (111) oriented |
| Density | 3.21 g/cm³ |
| Hardness | 2500 Vickers hardness(500g load) |
| Grain Size | 2~10μm |
| Chemical Purity | 99.99995% |
| Heat Capacity | 640 J·kg-1·K-1 |
| Sublimation Temperature | 2700℃ |
| Flexural Strength | 415 MPa RT 4-point |
| Young' s Modulus | 430 Gpa 4pt bend, 1300℃ |
| Thermal Conductivity | 300W·m-1·K-1 |
| Thermal Expansion(CTE) | 4.5×10-6K-1 |
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