CVD SiC Coating Nozzle
CVD SiC Coating Nozzle is manufactured using a high-density isostatic graphite substrate combined with a dense CVD silicon carbide (SiC) coating. In epitaxial growth processes such as Si epitaxy, SiC epitaxy, and MOCVD deposition, the nozzle plays a critical role in introducing and directing process gases into the reaction chamber. By enabling stable gas flow and precise distribution, it helps maintain uniform epitaxial layer growth and consistent wafer quality. Semixlab CVD SiC Coating Nozzle is widely used in epitaxy reactors, MOCVD systems, and high-temperature CVD equipment. Looking forward to your inquiry.
Description
The CVD SiC Coating Nozzle is a critical gas delivery component in semiconductor epitaxial reactors. It is specifically engineered to withstand the high temperatures and chemically corrosive environments commonly encountered during epitaxial growth processes.
This SiC Coated Nozzle utilizes a high-purity isostatic graphite substrate combined with a dense chemical vapor deposition (CVD) silicon carbide (SiC) coating. The graphite substrate provides excellent machinability and thermal stability, while the SiC coating forms a high-purity, chemically inert protective layer, ensuring long-term reliable operation in demanding semiconductor manufacturing environments.
CVD SiC Coating Nozzle is widely used in silicon epitaxy, silicon carbide epitaxy, gallium nitride MOCVD, and other advanced deposition systems where precise gas distribution and contamination control are critical for maintaining process stability and wafer yield.
Roles of Nozzles in Semiconductor Epitaxial Processes
Within epitaxial reactors, process gases must be delivered with high precision into the reaction chamber to achieve uniform crystal growth. Nozzles play a critical role in introducing and directing precursor gases to the wafer surface.
Typical gases introduced via nozzles include:
● Silane (SiH₄)
● Trichlorosilane (TCS, SiHCl₃)
● Hydrogen (H₂) carrier gas
● Ammonia (NH₃)
● Metalorganic precursors in MOCVD systems
By controlling gas flow direction, velocity, and distribution, nozzles ensure reaction gases reach the wafer surface under stable, laminar flow conditions. This directly impacts key parameters:
● Epitaxial layer thickness uniformity
● Doping consistency
● Defect density on the wafer
● Overall process repeatability
Therefore, nozzles are considered essential components for gas injection and flow control within epitaxial chambers.
Specifications
| Basic physical properties of CVD SiC coating | |
| Property | Typical Value |
| Crystal Structure | FCC β phase polycrystalline, mainly (111) oriented |
| Density | 3.21 g/cm³ |
| Hardness | 2500 Vickers hardness(500g load) |
| Grain Size | 2~10μm |
| Chemical Purity | 99.99995% |
| Heat Capacity | 640 J·kg-1·K-1 |
| Sublimation Temperature | 2700℃ |
| Flexural Strength | 415 MPa RT 4-point |
| Young' s Modulus | 430 Gpa 4pt bend, 1300℃ |
| Thermal Conductivity | 300W·m-1·K-1 |
| Thermal Expansion(CTE) | 4.5×10-6K-1 |
Applications
Advantages in Epitaxial Growth Applications
● Exceptional corrosion resistance
Epitaxial growth processes commonly employ reactive gases such as hydrogen, chlorine-containing compounds, and ammonia. CVD SiC coatings demonstrate outstanding resistance to these corrosive environments, preventing material degradation and maintaining stable operation over extended process cycles.
● High-Temperature Performance
Epitaxial growth processes typically operate at temperatures exceeding 1000°C to 1500°C. SiC coatings maintain structural integrity and chemical stability under these extreme conditions, ensuring consistent and reliable performance.
● Low Particle Generation
Particle contamination is a major concern in semiconductor manufacturing. Dense, high-purity SiC coatings minimize surface erosion and spalling, helping maintain ultra-clean reactor environments and protecting wafer quality.
● Extended Equipment Lifespan
Compared to uncoated graphite components, SiC coatings act as a protective barrier, significantly extending nozzle service life. This reduces maintenance frequency, lowers replacement costs, and increases overall equipment uptime.
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