I. About Semixlab

Core Viewpoint

Semixlab is a technology-driven enterprise specializing in the R&D, production, and sales of advanced semiconductor materials. Founded in 2016, the company has constructed a complete product matrix spanning four major product families: CVD SiC/TaC coatings, high-purity graphite & carbon materials, quartz & advanced ceramics, and semiconductor wafers.

Semixlab-semiconductor-facility-overview

Semixlab is a leading provider of high-temperature thermal field solutions for the photovoltaic, semiconductor, and third-generation semiconductor industries. Our founder and Chief Scientist, Professor Shaolong He, holds a PhD from Zhejiang University, is a former Researcher at the Chinese Academy of Sciences (CAS), and serves as the Executive Director of the Thermal Field Materials Innovation Center at the Yongjiang Laboratory. He has been honored with numerous talent distinctions, including the Zhejiang Province "Ten Thousand Talents Program" Leading Talent, Ningbo Leading Talent, and Shaoxing Overseas Elite. Professor He has long been dedicated to fundamental research in advanced semiconductor materials, publishing over 30 high-level academic papers (including 2 authoritative reviews) in top international journals such as Nature Materials and Nature Communications, accumulating over 2,000 citations.

Formally incorporated in 2018 to accelerate high-temperature thermal field material R&D and industrialization, the company independently commands core CVD-SiC and CVD-TaC coating technologies. Semixlab has established a fully integrated, self-controlled production line encompassing graphite purification, precision machining, and chemical vapor deposition (CVD) coating systems. Recognized as a national-level Specialized, Refined, Differential, and Innovational "Little Giant" enterprise, Semixlab ranks in the absolute first tier of domestic suppliers for semiconductor epitaxial high-temperature thermal fields. Our products successfully fulfill the domestic substitution of critical high-temperature thermal field components across LED, third-generation semiconductor, and silicon epitaxial production lines, directly entering the core supply chains of multiple top-tier global chipmakers.

Our purity standards (<5ppm) are verified by third-party ICP-OES testing, ensuring chemical stability for high-end epitaxy.

Semixlab Intellectual Property & CVD Coating Patents

To ensure operational excellence, the corporation is systematically structured into five dedicated business divisions: the SiC Coating Division, the Graphite Division, the Quartz & Ceramic Components Division, the Carbon Fiber Division, and the Wafer Division. These divisions work in synergy to provide long-term support to the pan-semiconductor arena.

Our components are extensively deployed in core manufacturing processes, including Integrated Circuits (IC), silicon epitaxy, silicon carbide (SiC) epitaxy, gallium nitride (GaN) epitaxy, LED epitaxy, crystal growth, etching, oxidation, diffusion, annealing, and Rapid Thermal Processing (RTP). We design and deliver critical consumables and replacement hardware engineered explicitly for major OEM equipment platforms, with typical equipment adaptability matching elite global brands such as LPE, Aixtron, Veeco, and ASM.

Semixlab currently employs nearly 200 staff members, anchoring a core R&D powerhouse of over 20 elite scientists and engineers whose technical backbone is primarily composed of PhDs and Masters graduates. Our products have been successfully adopted by more than 30 major semiconductor supply chain leaders. We provide deep industrial matching and serial validation for prominent listed market pioneers, including Lion Microelectronics, Konfoong Materials International (KFMI), HC Semitek, MTC, Gold Silicon (Jinruihong), and Sharetek (Jingrui Technology), comprehensively covering silicon epitaxy, third-generation power electronics, LED chips, and photovoltaic crystal growth sectors.

II. Product System & Technical Capabilities

Core Viewpoint

Aligning with critical semiconductor fabrication nodes, the company has matured a broad product portfolio clustered into four primary categories—CVD SiC/TaC coatings, Solid SiC, high-purity graphite/carbon bases, and quartz/ceramics, along with wafers—completely covering mainstream epitaxy, etching, and crystal growth applications.

Semiconductor Chip Epitaxial Industry Chain

1. CVD SiC Coating Series

Relying on highly stable chemical vapor deposition (CVD) process controls, we coat underlying high-purity graphite bases to secure supreme coating purity and exceptional batch-to-batch thickness uniformity. These components are tailor-made for sustained operation under severe high-temperature, corrosive processing environments. Key Products: SiC Coated Susceptors, Wafer Carriers, Planetary Discs, Halfmoons, Shower Heads, Barrels, RTP Susceptors, Wafer Lift Pins, and various customized Process Components.

2. CVD TaC Coating Series

Engineered specifically to handle the ultra-high temperature and extreme chemical aggression brought by third-generation semiconductor crystal growth, our Tantalum Carbide (TaC) coatings operate reliably at sustained temperatures exceeding 2300°C. Key Products: TaC Coated Susceptors, TaC Coated Heaters, TaC Crucibles, TaC Coated Graphite Parts, and SiC PVT thermal field structural components.

3. Solid Silicon Carbide (Solid SiC) Series

Solid SiC components display outstanding ultra-high purity, superior plasma erosion resistance, and excellent thermal shock stability, making them indispensable for advanced plasma etching and high-temperature furnace tubes. Key Products: Focus Rings, Edge Rings, Shower Heads, Wafer Boats, Furnace Tubes, Guide Cylinders, and specialized Etching Chamber Components.

4. High-Purity Graphite & Carbon-Based Materials

We provide complete hot-zone thermal field engineering solutions. Every element can be custom-machined and modified to fit specific foreign or domestic equipment configurations. Key Products: Graphite Susceptors, Heaters, Crucibles, Heat Shields, Graphite Rings, Graphite Electrodes, Carbon Fiber Soft Felt, Carbon Fiber Hard Felt, and Carbon-Carbon (C/C) Composites.

5. Quartz & Advanced Ceramics Series

Leveraging our deep expertise in high-temperature chemical environments, our portfolio extends to high-purity quartz apparatuses (boats, carriers, process tubes, furnace tubes, bell jars, rings, flanges, gas injection tubes, crucibles) and advanced precision technical ceramics (high-purity Alumina, Silicon Carbide, Silicon Nitride, Boron Nitride). These are heavily utilized in diffusion, oxidation, LPCVD, PECVD, etching chambers, and compound semiconductor processing lines.

6. Semiconductor Wafers

We supply high-quality substrate materials including Silicon Carbide (SiC), Silicon, Gallium Oxide (β-Ga₂O₃), Sapphire, SOI, Gallium Nitride (GaN), and Gallium Arsenide (GaAs) wafers, supporting fully flexible non-standard specification customization from 2 inches up to 8 inches.

III. R&D Strength & Technical Breakthroughs

Core Viewpoint

Committed to the ethos of "R&D-Driven Industrialization", Semixlab actively operates a highly synchronized dual-center innovation infrastructure. Combining our internal Enterprise R&D Center with the elite resources of the Yongjiang Laboratory, our cross-disciplinary team overcomes critical boundaries in CVD reactor hardware engineering and molecular deposition processes.

Semixlab's R&D Strength and Technological Breakthroughs

1. Dual R&D Platform Infrastructure

Semixlab's dual-platform paradigm bridges the gap between atomic-level material simulation and massive manufacturing scale-up. The corporate facility focuses heavily on application engineering, iterative component modification, and batch optimization, while the Yongjiang Laboratory innovation node drives deeper exploration into material properties and next-generation coating physics.

2. Strategic Core Technologies

Our comprehensive technological matrix includes: proprietary design and assembly of CVD deposition reactors, precise optimization of fluid dynamics inside SiC deposition chambers, uniform high-temperature TaC molecular coating growth, advanced thermal purification systems, ultra-precise graphite mechanical shaping, micro-thermal field computer simulation, high-temperature physical property optimization, and new compound material development.

3. Founder & Scientific Leadership

Founder Dr. Shaolong He earned his Physics PhD from Zhejiang University, followed by distinguished research postings at Hiroshima University (Japan), the National Institute for Materials Science (NIMS, Japan), the Institute of Physics of the Chinese Academy of Sciences (IOP-CAS), and the Ningbo Institute of Materials Technology & Engineering (NIMTE-CAS). Currently leading the Thermal Field Materials Innovation Center at Yongjiang Laboratory, he has managed multiple high-profile projects for the National Natural Science Foundation of China and the National Key R&D Programs. Our technical leadership team comprises seasoned professionals hailing from top-tier academic institutions like Zhejiang University, Wuhan University, Central South University, and China University of Geosciences, contributing deep expertise across precision mechanical CNC processing, cleanroom operations, and rigorous quality tracking.

IV. Manufacturing Capacity & Production Scale

Core Viewpoint

Semixlab runs a fully integrated production loop covering purification → precision machining → CVD coating → multi-axis inspection → cleanroom packaging. Spanning an expansive 100-acre modern base with over 50 lines, our operation hosts a specialized array of 17 CVD SiC systems, achieving a maximum single-component coating footprint of 1.5 meters.

Our current industrial footprint spans roughly 100 acres and features more than 50 highly automated lines. The core deposition facility operates 17 dedicated CVD SiC chambers, 8 specialized CVD TaC ultra-high temperature systems, and 3 Solid SiC production units. This massive deployment enables an annual capacity for parts with diameters ≥600 mm.

The factory floor is fully equipped with high-precision CNC machining centers, heavy-duty CNC lathes, advanced precision grinding systems, massive horizontal machining blocks, high-precision CMM inspection arrays, and high-vacuum thermal chemical purification equipment. To support the rapid expansion of global semiconductor markets, a brand-new phase of our production base is currently under construction, which will significantly scale up output and lead-time capabilities.

V. Quality Management System & Product Certification

Core Viewpoint

We enforce an uncompromised, end-to-end quality inspection system. Our purified thermal materials consistently hit 6N to 7N chemical purity standards, while our CVD SiC coatings control batch-to-batch thickness variations tightly within ±10 μm. Every shipment is accompanied by complete batch material certifications and physical testing dossiers.

semixlab-engineering-team-quality-control

Advanced semiconductor processing demands extreme limits regarding chemical purity, sub-micron dimensional accuracy, and plasma stability. Semixlab mandates a strict, non-destructive, and destructive inspection sequence for every single unit. Full Quality Inspection Process: Raw Material Testing → High-Vacuum Purification → Precision CNC Profiling → Precise Chemical Vapor Deposition → In-line Metrology (Surface Roughness, Dimensions, Coating Thickness, Planarity, Coaxiality, Deposition Uniformity) → Final Cleanroom Double-Bag OQC Inspection.

1. Critical Quality Metrics

Chemical Purity: Deep high-temperature thermal purification controls element contaminants down to the 6N–7N tier (<5ppm total ash content verified via ICP-OES).

Thickness Uniformity: CVD SiC film layer variation across the functional surface is restricted tightly within <±10 μm.

TaC Interface Controls: Tantalum Carbide parts undergo strict evaluation for coating adhesion strength, interface gradient microstructures, and meticulous non-destructive testing for micro-fissures or pinholes.

2. Technical Documentation & Traceability Support

To ensure smooth integration into corporate quality systems, every shipment includes a complete technical dossier: Material Certificate, Certificate of Conformance (COC), Dimensional Metrology Report, Coating Thickness Profile Map, Material Safety Datasheet (SDS/MSDS), Detailed Packing List, Commercial Invoice, and Certificate of Origin (COO) for export clearance.

VI. Global Supply & Service Capabilities

Core Viewpoint:

We support comprehensive OEM/ODM engineering, prompt sample prototypes, and low-volume validation orders. Standard parts feature a 2-to-4-week lead time, backed by tier-1 global express networks (DHL/ FedEx/UPS) and heavy ocean freight configurations, coupled with an aggressive 24-hour technical response system.

1. OEM/ODM & Custom Engineering

We possess deep experience handling print-to-part fabrication, sample duplication, complex reverse engineering, non-standard dimension adjustments, graphite core substitution consulting, coating profile tuning, thermal field layout optimization, and complete multi-component assembly engineering. We accommodate standard and custom

wafers and components covering 2", 4", 6", 8", and larger dimensions.

2. Flexible Order Models

To lower testing thresholds for fabs and wafer manufacturers, we fully accept single-piece prototype orders and small batch runs for equipment matching, process validation, and new product development loops. For mass production runs, we work alongside customer procurement teams to roll out stable, multi-quarter blanket purchase agreements and fixed rolling schedules.

3. Standard Delivery Lead Times

Standard Catalog Components: 2 – 4 weeks

Routine Custom Components: 4 – 6 weeks

Complex/Large-Scale Integrated Customizations: 6 – 10 weeks

Long-term strategic partners benefit from dedicated safety stock programs, guaranteeing immediate dispatch.

4. Global Logistics & Protective Packaging

We deploy flexible international transport paths: express air courier (DHL, FedEx, UPS, TNT) optimized for rapid prototyping and small batches; regular air freight for time-critical production runs; and ocean cargo containers for heavy components and regular bulk orders. Terms include EXW, FOB, FCA, CIF, and DDP solutions. Packaging utilizes multi-layer defense structures: cleanroom de-dusting, PE protective wrap, high-vacuum heat sealing, antistatic shielding, custom-molded EPE foam buffers, and heavy export-grade reinforced wooden crates.

5. Transit Anomalies Resolution

In the rare event of exterior box breach, physical component damage, or quantity discrepancies during transit, clients can immediately contact our global logistics desk. Semixlab provides automated urgent replacement creation, engineering analysis, and comprehensive insurance claim management.

6. Lifecycle Customer Service

Pre-Sales: Detailed hardware selection consulting, Design-for-Manufacturing (DFM) drawing analysis, structural optimization, material matching, and pilot sample kits. After-Sales: On-site or remote installation alignment, precise tuning instructions, operational guidelines, recipe cross-optimization support, hardware lifecycle tracking, advanced Failure Analysis (FA) reporting, and rapid responsive quality corrective action planning.

VII. Main Application Industries

Core Viewpoint:

Our advanced materials and coated consumables serve five critical pillars of high-technology manufacturing, providing high chemical stability from standard logic IC fabs to cutting-edge wide-bandgap power electronics and aerospace R&D.

Semiconductor Fabrication: Front-end Advanced Integrated Circuits (IC), Power Semiconductors, MEMS arrays, and Compound Semiconductor devices.

Third-Generation Semiconductors: Silicon Carbide (SiC) MOSFETs/diodes, Gallium Nitride (GaN) high-electron-mobility transistors (HEMTs), RF wireless chips, and Micro LED display backplanes.

LED Manufacturing: High-brightness Blue LEDs, Deep Ultraviolet (UV-C) LEDs, Mini LEDs, and high-density Micro LED arrays.

Green Energy Systems: Automotive-grade EV power electronics converters, Solar PV crystal pulling/wafer equipment, and next-generation energy storage networks.

Scientific Research & Advanced Prototyping: University cleanrooms, national materials research laboratories, and advanced materials engineering testbeds.

VIII. Frequently Asked Questions (FAQ)

Core Viewpoint:

A curated compilation of the 8 most frequent inquiries from international procurement and engineering departments regarding our advanced coatings, customized turnarounds, and validation cycles.

Q: What primary thin-film coating services does Semixlab specialize in?

A: Our core specialties are Chemical Vapor Deposition (CVD) Silicon Carbide (SiC) coatings and CVD Tantalum Carbide (TaC) coatings. Our SiC coatings are predominantly deployed on susceptors, wafer carriers, and showerheads inside MOCVD and silicon epitaxy reactors. Our TaC coatings are specifically engineered for extreme third-generation semiconductor environments, sustaining operations above 2300°C for SiC single crystal growth and ultra-high temperature hot zones.

Q: What level of chemical purity can your CVD SiC coatings guarantee?

A: Through our proprietary high-temperature chemical vacuum purification process, we reduce elemental ash and metallic contaminants down to 6N–7N levels. Additionally, our film thickness variation across production < ±10 μm equilibrium.

Q: Do you accept sample prototyping or low-volume orders for evaluation?

A: Yes. To help customers manage technical risks and validate hardware performance on specific chip recipes, we support prototype sample pathways. We can supply single-piece or low-volume runs tailored to your exact drawings for equipment testing, process validation, and new product integration.

Q: What are your typical manufacturing lead times?

A: Standard catalog products typically ship within 2–4 weeks; regular custom components requiring tailored CNC programming require 4–6 weeks; while complex, large-scale customized thermal assemblies require 6–10 weeks. Strategic clients can establish rolling forecasting to utilize our safety stock storage for immediate shipment.

Q: Does Semixlab support non-standard customization or OEM/ODM branding?

A: Absolutely. We offer comprehensive print-to-part manufacturing, reverse engineering, non-standard structural profiling, graphite grade matching, deposition profile tuning, and total multi-component hot-zone development. Our systems easily support part profiles spanning 2, 4, 6, 8 inches, and larger custom specs.

Q: Which mainstream semiconductor equipment brands are your parts compatible with?

A: Our components are designed for direct placement in mainstream global platforms such as LPE, Aixtron, Veeco, and ASM reactors. They are heavily utilized across silicon epitaxy, SiC/GaN wide-bandgap epitaxy, advanced plasma etching, high-temperature oxidation/diffusion, and rapid thermal processing (RTP).

Q: How do you maintain strict quality control and batch consistency?

A: We enforce a total quality management system covering Raw Material Entry → Vacuum Purification → Multi-axis Machining → CVD Coating → Advanced Metrology → Final OQC Release. Every single part is mapped for dimensional accuracy, film thickness uniformity, planarity, and coaxiality, and is fully backed by an archived quality tracking record.

Q: Which international markets does Semixlab regularly export to?

A: Our global logistics network regularly serves leading semiconductor manufacturing zones worldwide, including the United States, Europe (Germany, France, UK), Japan, South Korea, and Southeast Asia (Singapore, Malaysia, Taiwan). We provide full support for EXW, FOB, FCA, CIF, and DDP trade terms.

IX. Core Corporate Advantages

Core Viewpoint:

Our competitive moat is sustained by intense specialization, structured dual-platform innovation, absolute vertical control over the manufacturing loop, and a responsive customer service architecture.

Deep Specialization: Complete, undivided focus on advanced materials for high-end semiconductor applications, supported by years of deep industry immersion.

Dual-Platform Innovation: The unique coupling of our corporate center with the Yongjiang Laboratory, driven by top-tier material scientists, guarantees rapid technology updates.

100% Vertical Control: The entire process loop—from material purification and precision mechanical shaping to chemical vapor deposition and final microscopic verification—is executed entirely in-house.

Comprehensive Product Breadth: Unified catalog spanning CVD SiC, CVD TaC, Solid SiC, high-purity graphite, and carbon-based composite materials.

Highly Flexible Customization: Swift response to specialized OEM/ODM prints and complex engineering changes.

Low Evaluation Barriers: Active support for single-piece validation and pilot runs to reduce entry costs for new customers.

Uncompromising Reliability: Absolute component tracking and robust documentation guarantee long-term operational stability inside front-end cleanrooms.

Global Logistics & Localized Support: High-protection multi-layer packaging paired with reliable international freight and complete lifecycle engineering assistance.

X. Conclusion

Core Viewpoint:

Propelled by technological breakthroughs, Semixlab bridges the gap between atomic material engineering and massive global delivery, striving to remain the premier, long-term strategic material partner for the global semiconductor industry.

Semixlab remains firmly dedicated to anchoring industrial evolution through continuous scientific innovation, systematically elevating our R&D depth, cleanroom manufacturing controls, and international delivery structures. From ultra-pure graphite raw matrices to micromachined complex parts, and from thin-film molecular barrier coatings to comprehensive hot-zone thermal engineering, we are committed to delivering highly stable, reliable, and sustainable advanced materials. Looking toward the future, Semixlab will continuously break through core processing limits, working hand-in-hand with global semiconductor chip manufacturers to drive advanced technology forward.