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AMAT Single Ring Ceramic 0200-04877
AMAT 0200-04877 Single Ring Ceramic
AMAT Single Ring Ceramic 0200-04877
AMAT 0200-04877 Single Ring Ceramic

Single Ring Ceramic 0200-04877


AMAT 0200-04877 Single Ring Ceramic is a high-purity Al₂O₃ ceramic ring used in Applied Materials etch chambers. Designed for plasma control, wafer edge uniformity improvement, and chamber component protection, it delivers excellent resistance to plasma erosion, thermal stress, and particle generation. Semixlab provides high-quality sourcing solutions for AMAT 0200-04877 Single Ring Ceramic, supporting semiconductor fabs, OEM service providers, refurbishment companies, and equipment maintenance organizations worldwide. We look forward to receiving your inquiry.

Description

In advanced semiconductor plasma etching processes, the material stability, dimensional accuracy, and plasma compatibility of internal chamber components directly determine process window stability, yield performance, and equipment operating costs. The AMAT 0200-04877 Single Ring Ceramic is one of the critical ceramic functional components used in Applied Materials (AMAT) etch platforms. Primarily manufactured from high-purity alumina (Al₂O₃) ceramic, it is widely used in process control systems for wafer edge regions and chamber protection systems due to its excellent resistance to plasma corrosion, electrical insulation properties, and thermal stability.

In terms of structural characteristics, the 0200-04877 features a typical Single Ring Ceramic design, with its main body consisting of a high-purity alumina ceramic ring. Al₂O₃ material possesses low metal impurity content, high dielectric strength, excellent mechanical strength, and good thermal conductivity, demonstrating outstanding corrosion resistance in fluorine-based, chlorine-based, and oxygen-containing plasma environments. Compared to standard engineering ceramics, high-purity alumina effectively reduces the risk of particle release and minimizes process contamination while maintaining long-term dimensional stability, thereby meeting the stringent requirements of advanced processes for critical chamber components.

In AMAT etching platforms, the Single Ring Ceramic is typically installed in the peripheral area of the Electrostatic Chuck (ESC), positioned between the wafer edge and the inner wall of the chamber, serving as a critical functional component within the etching chamber. Its core function is not merely structural support, but rather participation in the optimization and control of the overall plasma field distribution. During high-density plasma etching, the wafer edge region is often prone to issues such as enhanced ion bombardment, edge etch rate drift, and deterioration of profile uniformity. Through its precisely designed geometry and dielectric properties, the Single Ring Ceramic modulates the edge electric field, guiding the plasma to form a more uniform energy distribution across the wafer surface. This improves the wafer edge profile and enhances Across-Wafer Uniformity (AWU) performance. Additionally, this ceramic ring protects the ESC edges, electrode assemblies, and underlying metal structures by preventing high-energy ions and reactive radicals from directly impacting critical components, thereby extending equipment maintenance intervals and reducing total cost of ownership.

As a critical consumable component subjected to long-term exposure in high-energy plasma environments, Single Ring Ceramic inevitably experiences material aging and performance degradation during use. Based on practical application experience from leading global wafer fabs and IDM companies, common failure modes primarily include dimensional loss due to plasma erosion, abnormal wear in edge chamfer areas, propagation of surface microcracks, increased particle release, and localized deposit buildup. When the surface of a ceramic ring is subjected to continuous ion bombardment, the material’s microstructure gradually changes, leading to increased surface roughness and a higher risk of particle generation. During high-temperature cycling and process switching, accumulated thermal stress may also trigger microcrack formation, further compromising process stability. When the critical dimensions of a ceramic ring exceed the equipment’s control specifications, this often results in reduced edge etch uniformity, critical dimension (CD) drift, increased particle defects, and yield loss.

As a professional platform specializing in semiconductor components and advanced material solutions, Semixlab is committed to providing high-quality semiconductor consumables and critical spare parts services to global customers in wafer manufacturing, equipment maintenance, and the component supply chain. Leveraging long-term research and practical experience with mainstream equipment platforms such as AMAT, LAM Research, TEL, Kokusai, and Hitachi High-Tech, Semixlab not only provides high-purity ceramic component solutions that meet OEM standards but also offers material analysis, dimensional verification, failure analysis, and domestic substitution evaluation services tailored to customers’ specific application needs. For critical chamber components such as the 0200-04877 Single Ring Ceramic, Semixlab has established a comprehensive quality control system covering raw material purity control, precision machining, critical dimensional inspection, and surface quality management, ensuring stable product performance in harsh plasma environments.

Leveraging extensive industry experience, rapid response capabilities, and global supply chain resources, Semixlab continuously helps customers shorten procurement cycles, reduce maintenance costs, and improve equipment uptime. For customers seeking OEM alternatives, spare parts lifecycle management, or advanced etching process optimization, Semixlab is not merely a parts supplier but a trusted partner for semiconductor equipment maintenance and process support.

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