0200-10377 Ring Single 195mm DPS Chamber

Manufactured with high-purity semiconductor-grade ceramic materials and precision machining technology, this ceramic ring component offers exceptional resistance to plasma erosion, thermal cycling, and particle generation in aggressive dry etching environments.

The AMAT 0200-10377 Ring Single 195mm DPS Chamber is a precision ceramic ring component primarily used in AMAT DPS (Decoupled Plasma Source) systems for 200mm wafer processing applications.

Key Features:

● High-purity ceramic material

● Excellent RF plasma compatibility

● Low contamination and particle generation

● Superior plasma erosion resistance

● High mechanical and thermal stability

● Precision machining for DPS chamber integration

Roles in AMAT DPS Systems

In AMAT DPS plasma etching systems, the Ring Single 195mm Ceramic Component functions as a critical plasma control and chamber protection part.

Plasma Edge Control

The ceramic ring helps optimize plasma distribution near the wafer edge, improving etching uniformity and minimizing edge process deviation during high-density plasma processing.

ESC & Chamber Protection

Installed around the electrostatic chuck (ESC) area, the ring acts as a protective barrier against aggressive plasma chemistries, helping reduce chamber erosion and extending component lifetime.

RF Plasma Stabilization

With stable dielectric characteristics, the ceramic ring contributes to improved RF coupling and plasma stability inside the DPS chamber.

Contamination Reduction

Its high-purity ceramic structure minimizes particle generation and metal contamination, supporting advanced semiconductor process cleanliness requirements.

Typical Applications in Semiconductor Processes

The AMAT 0200-10377 Ring Single 195mm DPS Chamber is widely used in advanced dry etching and plasma processing applications, including:

Dielectric Etching: Supports stable plasma behavior during oxide and dielectric layer etching processes.

Oxide & Contact Etch: Helps improve etch uniformity and wafer edge control in contact and via formation processes.

Metal Etching: Provides chamber protection and process stability in metal plasma etching environments.

Advanced Plasma Processing: Suitable for high-density plasma applications requiring low particle contamination and stable RF performance.

200mm Semiconductor Manufacturing: Optimized for AMAT DPS systems processing 8-inch wafers in semiconductor fabs.

Why Semixlab?

Semixlab specializes in advanced semiconductor ceramic components for plasma etching, deposition, and thermal processing equipment.

We provide:

● Semiconductor-grade ceramic materials

● Precision machining capabilities

● OEM-compatible semiconductor parts

● Stable quality control

● Customized ceramic solutions

Our mission is to support semiconductor manufacturers with reliable, high-performance material solutions for next-generation wafer fabrication equipment.