0200-09721 Ceramic Ring Floating Skirt
Semixlab specializes in high-performance semiconductor ceramic components designed for harsh plasma and thermal handling environments. Our AMAT 0200-09721 ceramic ring floating skirt is designed to provide Applied Materials (AMAT) semiconductor device systems with superior thermal stability, plasma resistance, and contamination control. We look forward to your inquiry.
Description
The AMAT 0200-09721 Ceramic Ring Floating Skirt is a precision ceramic chamber component commonly used in AMAT semiconductor processing systems. Engineered for high-temperature and plasma-intensive environments, the component provides exceptional:
● Thermal resistance
● Electrical insulation
● Plasma erosion resistance
● Chemical stability
● Low particle generation
Semixlab focuses on high-purity ceramic manufacturing technologies to ensure consistent quality, tight tolerances, and excellent compatibility with semiconductor process requirements.
Roles in AMAT Systems
In AMAT semiconductor equipment, the Ceramic Ring Floating Skirt functions as a critical chamber protection and process stabilization component.
Its primary roles include:
Plasma Boundary Control
The ceramic ring helps maintain stable plasma distribution inside the process chamber, contributing to improved process uniformity across the wafer surface.
Chamber Protection
It acts as a protective barrier between aggressive plasma chemistries and sensitive chamber structures, reducing chamber wear and extending maintenance intervals.
Electrical Isolation
The floating skirt structure provides electrical insulation between chamber components, helping stabilize RF plasma behavior during deposition or etching processes.
Thermal Stability Support
Under high-temperature processing conditions, the ceramic ring maintains structural integrity and dimensional stability, ensuring consistent process performance.
Typical Applications in Semiconductor Processes
The AMAT 0200-09721 Ceramic Ring Floating Skirt is widely used in advanced semiconductor fabrication processes, including:
1. PECVD (Plasma Enhanced Chemical Vapor Deposition)
Supports stable plasma conditions and minimizes contamination during dielectric film deposition.
2. Plasma Etching
Provides plasma resistance and chamber protection in fluorine- and chlorine-based etching environments.
3. PVD (Physical Vapor Deposition)
Helps maintain clean chamber conditions and improves process repeatability.
4. High-Temperature Semiconductor Processing
Performs reliably in thermal cycling environments requiring excellent heat resistance and low particle generation.
5. Advanced Logic & Memory Manufacturing
Suitable for process environments with strict contamination and uniformity requirements.
Why Choose Semixlab?
At Semixlab, we combine advanced ceramic material expertise with semiconductor process understanding to deliver reliable chamber components for global semiconductor customers.
We provide:
● Precision ceramic machining
● High-purity material solutions
● Semiconductor-grade quality control
● Customized OEM/ODM support
● Stable supply capability
Semixlab is committed to supporting next-generation semiconductor manufacturing with reliable, high-performance material solutions.
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